TE0803-04-4BE11-A

Overview

The TE0803-04-4BE11-A is a System-on-Module manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates an AMD Zynq UltraScale+ MPSoC architecture, combining programmable logic with processing system capabilities. The module includes integrated memory components to support complex data processing tasks. Its compact form factor facilitates integration into space-constrained industrial and commercial designs requiring robust FPGA-based computing power.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC for combined processing and programmable logic
• Includes onboard DDR4 SDRAM for high-speed data handling
• Compact modular design suitable for space-constrained embedded systems
• Supports rapid prototyping and scalable production workflows

Applications

• Industrial automation and control systems
• Medical imaging and diagnostic equipment
• Telecommunications infrastructure hardware
• Automotive infotainment and driver assistance systems

Procurement Notes

Verify current availability status directly with the manufacturer or authorized distributors, as supply chain conditions for FPGA modules can fluctuate. Confirm that the specific suffix matches the required pinout and memory configuration for your carrier board design. Ensure compliance with relevant regional regulatory standards before final procurement decisions.

Selection Notes

Select this module when a balance of processing power and programmable logic is required in a small footprint. Compare against other TE0803 variants based on specific SoC speed grades and memory capacity requirements. Evaluate thermal management needs relative to the target application's workload and operating environment constraints.

Part Context

This component belongs to the TE0803 family of System-on-Modules from Trenz Electronic, which specializes in FPGA and SoC solutions. The family offers various configurations based on Xilinx and AMD processors, providing engineers with flexible options for developing custom embedded hardware solutions ranging from prototypes to mass production.

Replacement Considerations

No public confirmed substitutes are listed in the provided documentation. Due to the proprietary nature of the module integration and specific pin mappings, direct replacements may require significant carrier board redesign. Consult Trenz Electronic engineering support for potential migration paths or updated module versions.