TE0803-04-4DE11-A

TE0803-04-4DE11-A

$514.25
  • Description:IC MODULE ZYNQ USCALE 2GB 128MB
  • Series:TE0803

SKU:a6d86c6fe352 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MODULE ZYNQ USCALE 2GB 128MB
  • Series:TE0803
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU4EV-1SFVC784E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:B2B
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0803-04-4DE11-A

Overview

The TE0803-04-4DE11-A is a System-on-Module manufactured by Trenz Electronic, designed for high-performance embedded computing applications. This module integrates an AMD Zynq UltraScale+ MPSoC, specifically the ZU3EG variant, providing combined FPGA and processor capabilities. It includes 2 GByte of DDR4 memory to support complex data processing tasks. The physical form factor measures 5.2 x 7.6 cm, facilitating integration into compact industrial and commercial systems requiring robust computational resources.

Feature Summary

  • Integrates AMD Zynq UltraScale+ MPSoC with ZU3EG device
  • Includes 2 GByte DDR4 SDRAM for high-bandwidth memory access
  • Compact SOM form factor suitable for space-constrained designs
  • Supports modular system architecture for scalable development

Applications

  • Industrial automation and control systems
  • Medical imaging and diagnostic equipment
  • Telecommunications infrastructure components
  • Automotive infotainment and driver assistance systems

Procurement Notes

Verify current availability status directly with Trenz Electronic or authorized distributors, as supply conditions may vary. Confirm that the specific suffix -4DE11-A matches the required hardware revision and feature set for your design. Ensure compatibility with existing carrier boards or baseboards before procurement. Request updated documentation to confirm pinout and electrical specifications remain unchanged.

Selection Notes

Select this module when an AMD Zynq UltraScale+ ZU3EG processor is required within a standardized SOM footprint. Consider the 2 GByte DDR4 capacity against application memory demands. Evaluate the 5.2 x 7.6 cm dimensions against mechanical constraints. Verify thermal management requirements for the MPSoC under expected load conditions. Ensure software toolchains support the specific ZU3EG silicon revision.

Part Context

This component belongs to the TE0803 family of System-on-Modules from Trenz Electronic, which specializes in FPGA and SoC solutions based on AMD Xilinx technology. The family offers various configurations tailored for different performance levels and interface requirements. Trenz Electronic provides comprehensive support including hardware design files, software drivers, and technical assistance for integrating these modules into end products.

Replacement Considerations

Publicly confirmed direct substitutes are not available in the provided source material. Engineers should evaluate other modules within the TE0803 series or consult Trenz Electronic for equivalent parts with similar MPSoC capabilities. Cross-referencing pinouts and electrical characteristics is essential when considering alternative vendors or next-generation replacements.

TE0803-04-4DE11-ATE0803-04-4DE11-A
$514.25
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