TE0803-04-4GE81-L

TE0803-04-4GE81-L

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:-

SKU:5504388376ea Category: Brand:

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Product Detailed Parameters

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:-
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:-
  • Core Processor:-
  • Co-Processor:-
  • Speed:-
  • Flash Size:-
  • RAM Size:-
  • Connector Type:-
  • Size / Dimension:-
  • Operating Temperature:-

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TE0803-04-4GE81-L

Overview

The TE0803-04-4GE81-L is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC processor with 2 GByte of DDR4 memory. The module features a compact form factor measuring 5.2 x 7.6 cm. It supports high-speed interfaces including PCIe, SATA, and USB 3.0, making it suitable for demanding industrial and commercial environments requiring robust processing capabilities.

Feature Summary

  • Integrates AMD Zynq UltraScale+ MPSoC for combined processing and programmable logic
  • Includes 2 GByte DDR4 SDRAM for high-bandwidth data handling
  • Compact 5.2 x 7.6 cm footprint for space-constrained designs
  • Supports multiple high-speed serial interfaces for versatile connectivity

Applications

  • Industrial automation controllers
  • Medical imaging systems
  • Telecommunications infrastructure equipment
  • Automotive infotainment units

Procurement Notes

Verify the specific suffix configuration against official Trenz Electronic documentation to ensure compatibility with required interface standards and memory configurations. Confirm availability status directly with authorized distributors as stock levels fluctuate. Request updated datasheets and mechanical drawings prior to integration to validate pinout and thermal requirements for your specific carrier board design.

Selection Notes

Select this module when a balance of ARM processing power and FPGA flexibility is required in a small form factor. Ensure the carrier board supports the necessary voltage rails and high-speed signal integrity for PCIe and SATA connections. Consider thermal management solutions if operating at maximum load, as the MPSoC generates significant heat during intensive computation tasks.

Part Context

Trenz Electronic specializes in FPGA and SoM solutions, leveraging components from major semiconductor manufacturers like AMD and Xilinx. The TE0803 series represents their modular approach to embedded computing, allowing engineers to accelerate development cycles. This specific model targets applications needing reliable performance in harsh environments, supported by Trenz's engineering services and long-term supply commitments.

Replacement Considerations

Check for newer revisions within the TE0803 series that may offer improved power efficiency or additional interface options. Verify pin-to-pin compatibility with existing carrier boards before substituting. Consult Trenz Electronic for validated alternative modules if the current part reaches end-of-life status.

TE0803-04-4GE81-LTE0803-04-4GE81-L

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