TE0803-04-5DE11-A

Overview

The TE0803-04-5DE11-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC architecture to deliver high-performance processing capabilities within a compact form factor. The module includes integrated DDR4 memory and supports various interface protocols required for complex system integration.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC technology
• Includes onboard DDR4 memory subsystem
• Compact modular design for rapid prototyping
• Supports standard expansion interfaces

Applications

• Industrial automation controllers
• Medical imaging devices
• Aerospace avionics systems
• Test and measurement equipment

Procurement Notes

Verify the specific suffix '5DE11' against official Trenz Electronic documentation to confirm exact silicon stepping and memory configuration. Availability status should be confirmed directly with the manufacturer or authorized distributors as supply conditions may vary. Ensure compatibility with baseboard designs before procurement.

Selection Notes

Select this module when a balance of ARM processor performance and FPGA programmability is required. Compare pinout compatibility with existing carrier boards. Verify thermal requirements for the specific enclosure environment. Confirm that the included memory capacity meets application data throughput needs.

Part Context

This component belongs to the Trenz Electronic TE0803 series of XMOD modules. These modules are engineered to simplify the adoption of Xilinx/AMD Zynq UltraScale+ devices by providing a standardized mechanical and electrical interface. The series targets developers needing rapid deployment of heterogeneous computing systems.

Replacement Considerations

Direct replacements are limited due to proprietary mechanical footprints and custom BIOS/firmware configurations. Evaluate other Trenz Electronic modules in the same XMOD family if pin-compatible. Cross-vendor substitution requires significant redesign of the carrier board and software stack.