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The TE0807-02-07EV-1E is a System-on-Module integrating the Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E processor with 4 GByte DDR4 SDRAM and 128 MByte SPI Flash. It features 20 Gigabit transceivers (4 GTR, 16 GTH), a GPU, and a VCU. Power delivery includes 14 DC/DC converters and 13 LDOs requiring a single 3.3V input. The module measures 52 x 76 mm and supports an operating temperature range of 0°C to +85°C.
Verify component availability as manufacturing status may vary. Confirm specific thermal requirements and cooling solutions with Trenz Electronic, as the module's operating temperature depends on the customer design. Ensure compatibility with base boards supporting the required B2B connector pinout. Check for any recent Product Change Notifications regarding assembly options or memory configurations.
Select this module when high-performance processing combined with multimedia capabilities is required in a compact form factor. The ZU7EV device offers significant programmable logic resources and processing power suitable for complex algorithms. Consider the 4 GByte DDR4 capacity for large buffer requirements and the extensive I/O count for diverse peripheral connectivity needs.
Trenz Electronic manufactures this module in Germany, specializing in FPGA and SoC modules for industrial and research applications. The TE0807 series provides scalable solutions based on AMD/Xilinx processors. This specific variant targets applications needing substantial computational throughput and video handling within a credit-card-sized footprint.
No public confirmed substitutes are identified in the provided documentation. As this is a specialized System-on-Module, direct replacements require matching the specific Zynq UltraScale+ ZU7EV processor, memory configuration, and mechanical dimensions. Evaluate alternative Trenz Electronic modules or custom designs if exact functional parity is required.
The module requires a single 3.3V power input. All internal voltage rails are generated onboard using 14 DC/DC converters and 13 LDOs.
No, the module supports all standard boot modes except for NAND flash.
The module is rated for an extended temperature range of 0°C to +85°C. However, the actual operating temperature depends on the customer's cooling solution and design.