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The Trenz Electronic TE0807-03-4BE21-A is an industrial-grade System on Module integrating a Xilinx Zynq UltraScale+ MPSoC (ZU7EV). It features up to 8 GBytes of DDR4 SDRAM via a 64-bit data bus and dual Quad SPI Flash memory totaling 512 MBytes. The module provides 20 Gigabit transceivers, extensive programmable I/Os, and onboard power management requiring a single 3.3V source. It utilizes four 160-pin Board-to-Board connectors within a compact 5.2 x 7.6 cm form factor.
Verify the specific ordering suffix against the manufacturer's current production list to ensure component availability and revision compatibility. Confirm that the baseboard design supports the required B2B connector stacking height and signal integrity specifications. Check for any mandatory assembly options or configuration constraints specified in the technical reference manual prior to integration.
Select this module when high-performance processing combined with significant memory capacity is required in a small footprint. Ensure the carrier board can supply the necessary 3.3V input and manage the thermal load associated with the ZU7EV package. Verify that the available PL HP GPIOs and MGT lanes meet the interface requirements for the target application.
This module belongs to the TE0807 series from Trenz Electronic, designed for rugged embedded environments. It is part of a broader portfolio of SoMs utilizing Xilinx Zynq UltraScale+ technology. The series emphasizes industrial reliability and flexibility through configurable I/O and robust power management solutions suitable for demanding operational conditions.
Consult the official Trenz Electronic documentation for confirmed substitute modules within the TE0807 family. Verify pinout compatibility and electrical characteristics before considering alternative vendors. No direct public substitutes are identified outside the manufacturer's ecosystem.