TE0807-03-4BE21-AK

TE0807-03-4BE21-AK

$915.46
  • Description:MPSOC MODULE TE0807 WITH ZYNQ UL
  • Series:TE0807

SKU:16b3914936b0 Category: Brand:

  
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Product Detailed Parameters

  • Description:MPSOC MODULE TE0807 WITH ZYNQ UL
  • Series:TE0807
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:Board-to-Board (BTB) Socket - 160
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:0°C ~ 85°C

Download product information

TE0807-03-4BE21-AK

Overview

The Trenz Electronic TE0807-03-4BE21-AK is an industrial-grade System-on-Module integrating the Xilinx Zynq UltraScale+ MPSoC ZU7EV. It supports up to 8 GBytes of DDR4 SDRAM via a 64-bit data bus and dual QSPI Flash memory with a maximum capacity of 512 MBytes. The module provides 20 Gigabit transceivers, including four GTR and sixteen GTH lanes, alongside extensive programmable I/Os. It operates on a single 3.3V power source with onboard switch-mode power supplies for all voltage domains.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ MPSoC ZU7EV in a 900-pin package
  • Supports up to 8 GBytes of DDR4 SDRAM with a 64-bit wide data bus
  • Features 20 high-speed serial transceivers (4 GTR + 16 GTH)
  • Includes onboard Si5345A programmable PLL clock generator

Applications

  • Industrial automation systems requiring robust processing
  • High-speed data acquisition and signal processing applications
  • Complex embedded control systems with FPGA logic requirements
  • Telecommunications infrastructure equipment

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production list to ensure availability. Confirm that the baseboard design accommodates the required B2B connector stacking height and signal integrity specifications. Check for any recent Product Change Notifications regarding component substitutions or revision updates before finalizing procurement plans.

Selection Notes

Select this module when a high-performance MPSoC with substantial memory bandwidth is required. Ensure the application utilizes the available PL HP GPIOs and PS MIOs effectively. Verify that the carrier board can supply the necessary clock signals to the B2B connectors if external clocking is preferred over the onboard Si5345A generator.

Part Context

This module belongs to the TE0807 series from Trenz Electronic, designed for compact form factors. It is part of the broader ecosystem of Xilinx-based SoMs, offering a balance between processing power and connectivity. The module is intended for integration into custom carrier boards via rugged board-to-board connectors.

Replacement Considerations

Consult the official Trenz Electronic documentation for confirmed equivalent modules within the TE0807 family. Verify compatibility with existing baseboard designs before substituting variants with different memory configurations or processor speeds.

TE0807-03-4BE21-AKTE0807-03-4BE21-AK
$915.46
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