TE0807-03-5AI21-A

Overview

The TE0807-03-5AI21-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Xilinx Zynq UltraScale+ MPSoC, specifically the XCZU5EV-1SFVC784I processor core. The module includes 2 GByte of DDR4 SDRAM for high-speed data processing and utilizes a compact 40 mm x 50 mm form factor. Key interface capabilities include DisplayPort, GMII, PCIe, SATA 3.1, and USB 3.0 connectivity, supporting diverse peripheral integration in industrial environments.

Feature Summary

• Integrates AMD Xilinx Zynq UltraScale+ MPSoC with dual ARM Cortex-A53 and quad ARM Cortex-A9 cores
• Includes onboard 2 GByte DDR4 SDRAM for efficient memory management
• Supports multiple high-speed interfaces including PCIe, SATA 3.1, and USB 3.0
• Compact 40 mm x 50 mm footprint suitable for space-constrained designs

Applications

• Industrial automation and control systems requiring real-time processing
• Medical imaging devices needing high-bandwidth video output via DisplayPort
• Automotive infotainment and telematics units utilizing USB 3.0 and PCIe
• Telecommunications infrastructure equipment requiring GMII Ethernet connectivity

Procurement Notes

This component is listed as End-of-Life (EOL) by the manufacturer. Availability is restricted or discontinued through standard distributors like Mouser. Engineers must verify current stock status with authorized suppliers or consider alternative sourcing channels. Procurement should account for potential supply chain limitations due to the product's retirement status.

Selection Notes

Select this module when a ruggedized MPSoC solution with integrated DDR4 and multiple high-speed I/Os is required. It is suitable for designs needing both programmable logic and application processing on a single chip. Ensure the carrier board supports the 40x50mm footprint and provides necessary power delivery for the Zynq UltraScale+ architecture. Verify thermal management requirements for the specific operating environment.

Part Context

The TE0807 series represents Trenz Electronic's modular system approach for Xilinx Zynq UltraScale+ MPSoCs. This specific variant targets applications demanding significant computational power alongside flexible I/O options. It serves as a building block for custom carrier boards, allowing developers to focus on system-level integration rather than complex PCB routing for the main SoC.

Replacement Considerations

As the TE0807-03-5AI21-A is discontinued, direct replacements may not be available from Trenz Electronic. Designers should evaluate newer generations of Xilinx MPSoCs or other vendors' SoM offerings. Compatibility checks are essential, particularly regarding pinout differences, power requirements, and software driver support for the new replacement component.