TE0807-03-7AI21-A

Overview

The TE0807-03-7AI21-A is a System-on-Module (SoM) manufactured by Trenz Electronic, integrating an AMD Zynq UltraScale+ MPSoC. This module features a dual-core ARM Cortex-A53 processor and a dual-core ARM Cortex-R5 real-time processor, alongside programmable logic resources based on the Zynq architecture. It includes integrated DDR4 memory and QSPI flash for system boot and data storage. The design supports industrial temperature ranges and provides high-speed interfaces including Ethernet, USB, and PCIe, making it suitable for demanding embedded applications requiring both processing power and hardware acceleration capabilities.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC with ARM Cortex-A53 and R5 processors
• Includes onboard DDR4 memory and QSPI flash for standalone operation
• Supports industrial operating temperature range for robust deployment
• Provides multiple high-speed I/O interfaces including Ethernet and PCIe

Applications

• Industrial automation and control systems
• Medical imaging and diagnostic equipment
• Automotive infotainment and instrument clusters
• Telecommunications infrastructure nodes
• High-performance embedded vision systems

Procurement Notes

Verify current availability status as this component may be subject to end-of-life notifications or limited supply conditions. Confirm that the specific revision matches your baseboard design requirements. Ensure compatibility with required operating system images and BSP versions provided by Trenz Electronic. Check for any recent engineering change notices that might affect pinout or functionality compared to earlier revisions of the TE0807 series.

Selection Notes

Select this module when a combined FPGA and ARM processor solution is required in a compact form factor. Consider the TE0807-03-7AI21-A if your application demands high computational throughput from the A53 cores while utilizing the programmable logic for custom hardware acceleration. Evaluate thermal management needs based on the specific workload distribution between the processor subsystem and the FPGA fabric. Ensure sufficient external memory bandwidth requirements are met by the onboard DDR4 configuration.

Part Context

Trenz Electronic specializes in FPGA and SoC modules designed for industrial and automotive applications. The TE0807 series represents their implementation of AMD Zynq UltraScale+ MPSoC technology. These modules are developed and manufactured in Germany, adhering to strict quality standards. The company provides comprehensive support including baseboards, carrier cards, and software development tools to facilitate rapid prototyping and production deployment for complex embedded systems.

FAQ

What is the primary difference between the TE0807-03-7AI21-A and other TE0807 variants?

The suffix indicates specific package type, speed grade, and temperature rating. The '7A' typically denotes a specific device size within the Zynq UltraScale+ family, while 'I21' refers to the industrial temperature range and specific package variant.

Does the module include pre-installed firmware?

Yes, the module typically comes with pre-flashed QSPI flash containing essential boot firmware and reference designs provided by Trenz Electronic to enable immediate testing and development.

Is the module compatible with standard Zynq development tools?

Yes, the module utilizes standard AMD Xilinx/Zynq components and is compatible with Vivado and Vitis development environments, although Trenz Electronic also provides customized BSPs and board support packages for easier integration.