TE0807-03-7DI21-A

Overview

The TE0807-03-7DI21-A is a System-on-Module manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates an AMD/Xilinx Zynq UltraScale+ MPSoC device, combining programmable logic with dual-core ARM Cortex-A53 and quad-core Cortex-R5 processors. The module includes integrated DDR4 memory and supports diverse interface protocols for industrial and commercial connectivity.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC with FPGA fabric and ARM processors
• Supports high-speed serial interfaces including PCIe and Gigabit Ethernet
• Provides flexible I/O options via standard expansion headers
• Designed for compact form factor integration in space-constrained systems

Applications

• Industrial automation and control systems
• Medical imaging equipment processing
• Telecommunications infrastructure nodes
• Automotive infotainment and instrument clusters

Procurement Notes

Verify current availability status as this component may be subject to discontinuation or limited supply conditions. Confirm the specific revision level matches your design requirements. Check for official replacement recommendations from Trenz Electronic if sourcing is restricted. Ensure compatibility with existing carrier board designs before procurement.

Selection Notes

Select this module when a combined FPGA and processor solution is required within a small footprint. Consider the available pin count and memory configuration against application bandwidth needs. Evaluate thermal management requirements based on the target operating environment. Verify that the supported peripheral interfaces align with system connectivity specifications.

Part Context

This module belongs to the TE0807 family of System-on-Modules from Trenz Electronic. These modules are engineered around Xilinx Zynq UltraScale+ MPSoC technology. The family offers various configurations tailored for different performance and interface requirements. They serve as core computing units for complex embedded designs requiring both hardware acceleration and software processing.