TE0807-03-7DI21-AZ

TE0807-03-7DI21-AZ

$2,051.06
  • Description:MPSOC MODULE WITH AMD ZYNQ ULTRA
  • Series:Zynq UltraScale+

SKU:9bce4b05071c Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:MPSOC MODULE WITH AMD ZYNQ ULTRA
  • Series:Zynq UltraScale+
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900I
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:Board-to-Board (BTB) Socket - 4 x 160
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:-40°C ~ 85°C

Download product information

TE0807-03-7DI21-AZ

Overview

The TE0807-03-7DI21-AZ is a System-on-Module (SoM) from Trenz Electronic, designed for high-performance embedded applications. It integrates an AMD Zynq UltraScale+ MPSoC with dual-core ARM Cortex-A53 and quad-core Cortex-R5 processors, alongside programmable logic fabric. The module includes onboard memory components such as DDR4 RAM and QSPI flash to support boot operations and data storage. It features comprehensive I/O interfaces including Gigabit Ethernet, USB, and PCIe, enabling connectivity in industrial and communication systems.

Feature Summary

  • Integrates AMD Zynq UltraScale+ MPSoC for combined processing and programmable logic capabilities
  • Includes onboard DDR4 memory and QSPI flash for system boot and data retention
  • Supports multiple high-speed serial interfaces including Gigabit Ethernet and PCIe
  • Compact form factor designed for integration into custom carrier boards

Applications

  • Industrial automation and control systems requiring real-time processing
  • Telecommunications infrastructure equipment
  • Medical imaging devices needing high-throughput data handling
  • Automotive infotainment and driver assistance systems

Procurement Notes

Verify component availability through authorized distributors or the manufacturer directly, as supply chain status may vary. Confirm that the specific suffix indicates the correct package type and temperature range required for your design. Ensure compatibility with your carrier board design regarding pinout and power requirements before procurement.

Selection Notes

Select this module when a combination of hard processor system performance and flexible FPGA fabric is required. Consider the memory configuration and I/O availability against your application's bandwidth needs. Evaluate thermal management solutions suitable for the module's operating environment and power consumption characteristics.

Part Context

This part belongs to the TE0807 series of SoMs by Trenz Electronic, which are based on AMD Xilinx Zynq UltraScale+ MPSoC technology. These modules are intended to accelerate development cycles by providing a pre-validated hardware platform. They serve as core computing units for various embedded projects, reducing the complexity of designing complex mixed-signal systems from scratch.

TE0807-03-7DI21-AZTE0807-03-7DI21-AZ
$2,051.06
Buy Now