TE0807-04-4BE81-A

Overview

The TE0807-04-4BE81-A is a System-on-Module manufactured by Trenz Electronic GmbH, integrating an AMD Zynq UltraScale+ MPSoC. This module provides a compact computing solution combining programmable logic with dual-core ARM Cortex-A53 and quad-core Cortex-R5 processors. It supports high-speed data processing and real-time control applications within a small form factor.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC for combined FPGA and processor functionality
• Includes onboard DDR4 memory and Flash storage for system configuration
• Features rugged board-to-board stacking connectors for high-speed I/O
• Incorporates an ultra-low jitter PLL for precise clock distribution

Applications

• Industrial automation and control systems
• Medical imaging devices requiring real-time processing
• Telecommunications infrastructure equipment
• Automotive infotainment and instrument clusters

Procurement Notes

Verify the specific silicon grade and package variant against project requirements before procurement. Confirm availability status as supply may be limited or subject to change. Ensure compatibility with existing carrier board designs regarding pinout and power delivery specifications. Check for any recent product change notifications that might affect long-term supply or component substitutions.

Selection Notes

Select this module when a compact form factor is required alongside significant programmable logic resources. Consider the integrated power management subsystem if minimizing external components is a priority. Evaluate the available I/O count against interface requirements such as Ethernet, USB, and PCIe. Ensure the thermal design of the host system can accommodate the MPSoC power dissipation in the enclosed module environment.

Part Context

This part belongs to the TE0807 series of System-on-Modules from Trenz Electronic. The series is designed around AMD Xilinx Zynq UltraScale+ MPSoCs, offering a balance of performance and power efficiency. These modules are intended for OEMs seeking to accelerate time-to-market for embedded applications by providing a pre-validated hardware platform.