TE0807-04-7DE81-A

Overview

The TE0807-04-7DE81-A is a high-performance System-on-Module (SOM) manufactured by Trenz Electronic. It integrates the Xilinx Zynq UltraScale+ MPSoC, combining dual-core ARM Cortex-A53 processors with quad-core ARM Cortex-R5 real-time cores and programmable logic fabric. This module is designed for demanding embedded applications requiring high computational throughput, low power consumption, and extensive I/O connectivity within a compact form factor.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC with ARM Cortex-A53 and R5 cores
• Features programmable FPGA logic fabric for custom hardware acceleration
• Supports multiple memory interfaces including DDR4 and LPDDR4
• Provides extensive peripheral connectivity via high-speed serial transceivers

Applications

• Industrial automation and control systems
• Medical imaging devices
• Telecommunications infrastructure equipment
• Automotive infotainment and driver assistance systems

Procurement Notes

Verify current availability status directly with Trenz Electronic or authorized distributors, as lead times may vary based on component supply chain conditions. Confirm that the specific revision matches your design requirements. Ensure compliance with relevant regional regulations regarding electronic components and RoHS directives before finalizing procurement decisions.

Selection Notes

Select this module when application requirements demand a balance of processing power, real-time control capabilities, and flexible I/O options. Consider the thermal management solutions required for the specific enclosure design. Evaluate the software support ecosystem, including Linux BSP and Vivado design tools, to ensure compatibility with existing development workflows and long-term maintenance needs.

Part Context

This module belongs to the Trenz Electronic TE0807 family, which utilizes the Zynq UltraScale+ MPSoC platform. The family offers various configurations tailored for different performance and interface needs. The TE0807 series is widely recognized in the embedded industry for its reliability and comprehensive support documentation, facilitating rapid prototyping and production deployment.

Replacement Considerations

Direct pin-to-pin replacements are not available due to the proprietary carrier board design. Alternative solutions require redesigning the carrier board to accommodate different SoC packages. Evaluate modules from other vendors using similar Xilinx Zynq MPSoC chips, but account for differences in pinout, power sequencing, and mechanical dimensions during the transition process.