TE0807-04-7DE81-AK

Overview

The TE0807-04-7DE81-AK is a microprocessor module manufactured by Trenz Electronic GmbH. It integrates an AMD Zynq UltraScale+ MPSoC, specifically the XCZU7EG-2SFVC1939E processor core. The module provides 2GB of LPDDR4 memory and 16MB of flash storage. It features a B2B connector interface and operates within a commercial temperature range of 0°C to 85°C. The physical dimensions are approximately 40mm x 50mm.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC with ARM Cortex-A53 and FPGA fabric
• Includes onboard LPDDR4 RAM and non-volatile flash memory
• Compact form factor designed for system-on-module applications

Applications

• Industrial automation controllers
• Medical imaging systems
• Automotive infotainment units
• Wireless infrastructure equipment

Procurement Notes

Verify component availability as this specific part number may be subject to obsolescence or limited stock status. Confirm the exact processor speed grade and memory configuration required for your design, as suffixes often denote specific binning or revision levels. Consult official Trenz Electronic documentation for current lifecycle status and recommended alternative modules if this unit is discontinued.

Selection Notes

Select this module when a high-performance heterogeneous computing solution combining processing and programmable logic is required. Ensure the host carrier board supports the specific B2B connector pitch and pinout defined in the technical reference manual. Verify that the thermal management design accommodates the power dissipation characteristics of the Zynq UltraScale+ device under maximum load conditions.

Part Context

This module belongs to the TE0807 series from Trenz Electronic, which focuses on Zynq UltraScale+ MPSoC implementations. These modules are designed to accelerate development cycles for complex embedded systems by providing a pre-validated hardware platform. The series typically offers various memory configurations and processor speed grades to suit different performance and cost requirements.

Replacement Considerations

Check for newer revisions within the TE0807 series that may offer updated silicon steppings or enhanced memory options. Consider other Trenz modules based on the same Zynq UltraScale+ family if pin compatibility allows for direct substitution on existing carrier boards.