TE0808-04-06EG-1EE

TE0808-04-06EG-1EE

  • Description:IC MODULE ZYNQ USCALE 4GB 128MB
  • Series:TE0808

SKU:0624b5f51618 Category: Brand:

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Product Detailed Parameters

  • Description:IC MODULE ZYNQ USCALE 4GB 128MB
  • Series:TE0808
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU6EG-1FFVC900E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:B2B
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0808-04-06EG-1EE

Overview

The Trenz Electronic TE0808-04-06EG-1EE is an industrial-grade System-on-Module integrating a Xilinx Zynq UltraScale+ XCZU9EG MPSoC. It supports up to 8 GBytes of DDR4 SDRAM via a 64-bit data bus and up to 512 MByte of Flash memory. The module features 20 Gigabit transceivers, including 4 GTR and 16 GTH lanes, alongside extensive programmable I/Os. Power management includes 14 on-board DC-DC converters and 13 LDO regulators, requiring only a single 3.3V input source.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ XCZU9EG MPSoC with heterogeneous processing system and programmable logic
  • Supports up to 8 GBytes of DDR4 SDRAM and dual parallel SPI Flash configuration
  • Includes onboard switch-mode power delivery with 14 DC-DC converters and 13 LDOs for flexible power domains
  • Features rugged board-to-board stacking connectors providing access to high-speed transceivers and configurable I/Os

Applications

  • Industrial automation and control systems
  • High-performance embedded digital signal processing
  • Ruggedized aerospace and defense applications
  • Advanced medical imaging equipment
  • Telecommunications infrastructure

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production list to ensure availability and correct component revision. Confirm that the baseboard design accommodates the required 3.3V power input specifications and thermal requirements for the MPSoC. Check for any recent engineering change notices or discontinuation notifications associated with this module variant before finalizing procurement plans.

Selection Notes

Select this module when a high-density MPSoC solution with significant memory capacity and extensive high-speed serial connectivity is required. The integrated power management simplifies baseboard design by reducing external component count. Ensure the application utilizes the available Gigabit Transceiver lanes and GPIO banks effectively within the compact form factor constraints.

Part Context

This module belongs to the TE0808 series from Trenz Electronic, designed for demanding embedded environments. It leverages the Xilinx Zynq UltraScale+ architecture to combine ARM processor cores with FPGA fabric. The series is characterized by its robust construction and comprehensive onboard peripherals, targeting sectors requiring reliable, high-throughput computing in space-constrained enclosures.

Replacement Considerations

No public confirmed substitutes are identified in the provided documentation. Due to the specific integration of the XCZU9EG package and proprietary power management layout, direct replacements require careful evaluation of pin compatibility and firmware adaptation.

FAQ

What is the maximum memory capacity supported by the TE0808-04?

The module supports up to 8 GBytes of DDR4 SDRAM connected via a 64-bit wide data bus.

How many Gigabit transceivers are available on this module?

The module provides 20 Gigabit transceivers, composed of 4 GTR lanes and 16 GTH lanes.

Does the module require multiple power supplies?

No, all on-board power supplies can be derived from a single 3.3V power source using the integrated DC-DC converters and LDOs.

TE0808-04-06EG-1EETE0808-04-06EG-1EE

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