TE0808-04-06EG-1EK

TE0808-04-06EG-1EK

  • Description:IC MOD SOM MPSOC
  • Series:TE0808

SKU:9b7239006327 Category: Brand:

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Product Detailed Parameters

  • Description:IC MOD SOM MPSOC
  • Series:TE0808
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU6EG-1FFVC900E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:B2B
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0808-04-06EG-1EK

Overview

The Trenz Electronic TE0808-04-06EG-1EK is an industrial-grade System-on-Module integrating a Xilinx Zynq UltraScale+ XCZU9EG MPSoC. It supports up to 8 GBytes of DDR4 SDRAM via a 64-bit data bus and includes dual SPI Flash memory for configuration. The module features 20 Gigabit transceivers, 65 PS MIOs, and over 200 PL GPIOs accessible through four rugged Board-to-Board connectors. Onboard power management utilizes 14 DC-DC converters and 13 LDOs, requiring only a single 3.3V input source.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ XCZU9EG MPSoC with heterogeneous processing system and programmable logic
  • Supports up to 8 GBytes of DDR4 SDRAM and dual parallel SPI Flash boot configurations
  • Includes onboard Si5345A programmable PLL clock generator with multiple differential outputs
  • Features comprehensive on-board power distribution with independent low-power, full-power, and PL domains

Applications

  • High-performance embedded digital signal processing systems
  • Industrial automation and process control applications
  • High-speed data acquisition and measurement systems
  • Automotive industry modules and high-end computing platforms

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production list, as variants may differ in memory density or component revisions. Confirm that the required baseboard design accommodates the specified 5.2 x 7.6 cm form factor and connector stacking heights. Ensure compatibility with the intended boot mode configurations via the B2B interface pins.

Selection Notes

Select this module when a high-density MPSoC solution with extensive I/O capabilities is required within a compact footprint. The integrated power management simplifies baseboard design by reducing external component count. Consider the available Gigabit Transceiver lanes if high-speed serial communication interfaces are necessary for the target application.

Part Context

Trenz Electronic GmbH specializes in FPGA and SoC-based development services and modules. The TE0808 series represents their UltraScale+ MPSoC offerings, designed for demanding industrial environments. These modules are developed and manufactured in Germany, providing turnkey solutions that bridge standard components with custom engineering requirements.

Replacement Considerations

Publicly confirmed direct substitutes are not identified in the provided documentation. As this is a specialized System-on-Module, replacement typically requires re-evaluating the baseboard design and firmware adaptation rather than a simple pin-compatible swap.

TE0808-04-06EG-1EKTE0808-04-06EG-1EK

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