TE0808-04-09EG-1EE

TE0808-04-09EG-1EE

  • Description:IC MODULE ZYNQ USCALE 4GB 128MB
  • Series:TE0808

SKU:75037640392a Category: Brand:

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Product Detailed Parameters

  • Description:IC MODULE ZYNQ USCALE 4GB 128MB
  • Series:TE0808
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU9EG-1FFVC900E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:B2B
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0808-04-09EG-1EE

Overview

The Trenz Electronic TE0808-04-09EG-1EE is an industrial-grade System-on-Module integrating the Xilinx Zynq UltraScale+ XCZU9EG MPSoC. It features up to 8 GBytes of DDR4 SDRAM via a 64-bit data bus and supports dual SPI Flash configuration with up to 512 MByte capacity. The module provides 20 Gigabit transceivers, including four GTR and sixteen GTH lanes, alongside extensive programmable I/Os. A compact 5.2 x 7.6 cm form factor houses rugged board-to-board connectors and on-board power management.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ XCZU9EG MPSoC with heterogeneous processing system and programmable logic
  • Supports up to 8 GBytes of DDR4 SDRAM connected via a 64-bit wide data bus
  • Includes onboard Si5345A programmable PLL clock generator for flexible timing requirements
  • Features integrated power delivery subsystem with multiple DC-DC converters and LDO regulators

Applications

  • Industrial automation and control systems requiring high-performance embedded processing
  • High-speed data acquisition and signal processing applications
  • Complex communication infrastructure utilizing gigabit transceivers
  • Ruggedized embedded computing solutions in harsh environments

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production list to ensure availability. Confirm that the baseboard design accommodates the required 3.3V single supply input and matches the pinout of the four 160-contact board-to-board connectors. Check for any recent hardware revisions or component substitutions that may affect mechanical or electrical compatibility.

Selection Notes

Select this module when a high-density MPSoC solution is required within a compact footprint. Ensure the application utilizes the available PS MIOs and PL HP GPIOs effectively. Consider the thermal requirements of the XCZU9EG package and verify that the baseboard can support the necessary power domains and heat dissipation strategies for continuous operation.

Part Context

This module belongs to the TE0808 series of System-on-Modules designed by Trenz Electronic. The series targets applications demanding significant computational power and connectivity. The TE0808-04 variant specifically integrates the ZU9EG package, offering a balance of processing performance and I/O density suitable for advanced embedded designs.

Replacement Considerations

Consult official documentation for confirmed substitutes. Verify compatibility of pinouts and power requirements if replacing with other modules in the TE0808 family or alternative vendors.

TE0808-04-09EG-1EETE0808-04-09EG-1EE

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