TE0808-04-09EG-1EL

TE0808-04-09EG-1EL

  • Description:IC MOD SOM MPSOC
  • Series:TE0808

SKU:0d06831d6c1a Category: Brand:

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Product Detailed Parameters

  • Description:IC MOD SOM MPSOC
  • Series:TE0808
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU9EG-1FFVC900E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:B2B
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0808-04-09EG-1EL

Overview

The Trenz Electronic TE0808-04-09EG-1EL is an industrial-grade System-on-Module integrating the Xilinx Zynq UltraScale+ XCZU9EG MPSoC. It features up to 8 GBytes of DDR4 SDRAM via a 64-bit data bus and supports dual SPI Flash configurations with up to 512 MByte capacity. The module provides 20 Gigabit transceivers, including four GTR and sixteen GTH lanes, alongside extensive programmable I/Os. It operates on a single 3.3V input, utilizing onboard power management with fourteen DC-DC converters and thirteen LDO regulators.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ XCZU9EG MPSoC for heterogeneous processing
  • Supports up to 8 GBytes of DDR4 SDRAM with 64-bit wide data bus
  • Includes Si5345A programmable PLL clock generator with ten outputs
  • Features rugged board-to-board stacking connectors for high-speed I/O access

Applications

  • High-performance embedded digital signal processing systems
  • Industrial automation and process control applications
  • High-speed data acquisition and measurement systems
  • Automotive industry embedded solutions

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production list to confirm availability and hardware revision. Ensure baseboard design compatibility with the 0.50 mm pitch B2B connectors. Confirm that the required memory density and boot mode configurations align with the module's initial delivery state, which typically ships with unprogrammed flash and PLL OTP.

Selection Notes

Select this module when requiring a compact form factor with significant processing power and high-speed serial connectivity. The integrated power management simplifies baseboard design by reducing external component count. Consider the available PL HP GPIOs and MGT lanes for interface requirements. Verify thermal management needs, as the module supports skyline heat spreader mounting for industrial temperature ranges.

Part Context

Trenz Electronic GmbH specializes in FPGA and SoC modules for industrial and automotive sectors. The TE0808 series represents their UltraScale+ MPSoC offerings, designed for high-end applications requiring robust performance and flexibility. These modules are developed and manufactured in Germany, providing engineering support and turnkey design services for complex embedded systems.

Replacement Considerations

Publicly confirmed direct substitutes are not identified in the provided documentation. For legacy replacement, evaluate other Trenz Electronic TE08xx series modules or comparable Xilinx-based SOMs from different manufacturers, ensuring pinout and mechanical compatibility with existing baseboards.

TE0808-04-09EG-1ELTE0808-04-09EG-1EL

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