TE0808-04-09EG-2IE

TE0808-04-09EG-2IE

  • Description:IC MODULE ZYNQ USCALE 4GB 128MB
  • Series:TE0808

SKU:eadffb1a2464 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:IC MODULE ZYNQ USCALE 4GB 128MB
  • Series:TE0808
  • Mfr:Trenz Electronic GmbH
  • Package:Box
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU9EG-1FFVC900E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:B2B
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:-40°C ~ 85°C

Download product information

TE0808-04-09EG-2IE

Overview

The TE0808-04-09EG-2IE is a System-on-Module integrating the AMD Zynq UltraScale+ MPSoC ZU9EG. It features up to 4GB of DDR4 SDRAM with a 32-bit width and supports configuration via up to 512MB of Flash memory. The module includes an onboard power delivery subsystem comprising 14 DC/DC converters and 13 LDO regulators managed by an ultra-low power MCU. Rugged board-to-board stacking connectors provide 480 terminals for high-speed transceiver I/Os, while an ultra-low jitter PLL supplies clocks to 20 serial transceivers.

Feature Summary

  • Integrates AMD Zynq UltraScale+ MPSoC processing system and programmable logic
  • Onboard switch-mode power delivery with multiple DC/DC converters and LDO regulators
  • Supports Micron XTRMFlash and Spansion/Cypress HyperRAM or HyperFlash devices
  • Ultra-low jitter PLL provides clocks to 20 serial transceivers

Applications

  • High-speed data acquisition systems
  • Embedded digital signal processing applications
  • Industrial automation and control
  • Automotive infotainment and instrumentation

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current documentation to ensure correct memory configuration and temperature grade. Confirm compatibility with carrier boards regarding the 480-terminal connector interface. Check for updated engineering change notices that may affect pin assignments or supported memory types. Ensure the design accounts for the thermal requirements of the integrated power management subsystem.

Selection Notes

Select this module when requiring a compact form factor with integrated high-performance processing and significant memory capacity. Consider the available assembly options for volatile and non-volatile memory expansion if standard configurations are insufficient. Evaluate the rugged board-to-board connectors for suitability in high-vibration environments. Verify that the onboard power management meets the specific voltage rails required by the target application peripherals.

Part Context

Trenz Electronic specializes in FPGA and SoC modules for industrial and automotive applications. The TE0808 series represents their UltraSoM+ line, designed for scalability and integration of AMD Zynq UltraScale+ MPSoCs. This product family supports rapid prototyping through mass production, offering flexible memory configurations and robust connectivity solutions for complex embedded designs.

Replacement Considerations

Publicly confirmed direct substitutes are not available in the provided source material. Designers should evaluate other Trenz Electronic TE08xx series modules based on specific processing performance and memory requirements. Cross-compatibility with carrier boards must be verified manually due to potential differences in connector layouts and pin definitions across different module variants.

TE0808-04-09EG-2IETE0808-04-09EG-2IE

Click on the inquiry