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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The TE0808-04-09EG-2IE is a System-on-Module integrating the AMD Zynq UltraScale+ MPSoC ZU9EG. It features up to 4GB of DDR4 SDRAM with a 32-bit width and supports configuration via up to 512MB of Flash memory. The module includes an onboard power delivery subsystem comprising 14 DC/DC converters and 13 LDO regulators managed by an ultra-low power MCU. Rugged board-to-board stacking connectors provide 480 terminals for high-speed transceiver I/Os, while an ultra-low jitter PLL supplies clocks to 20 serial transceivers.
Verify the specific ordering suffix against the manufacturer's current documentation to ensure correct memory configuration and temperature grade. Confirm compatibility with carrier boards regarding the 480-terminal connector interface. Check for updated engineering change notices that may affect pin assignments or supported memory types. Ensure the design accounts for the thermal requirements of the integrated power management subsystem.
Select this module when requiring a compact form factor with integrated high-performance processing and significant memory capacity. Consider the available assembly options for volatile and non-volatile memory expansion if standard configurations are insufficient. Evaluate the rugged board-to-board connectors for suitability in high-vibration environments. Verify that the onboard power management meets the specific voltage rails required by the target application peripherals.
Trenz Electronic specializes in FPGA and SoC modules for industrial and automotive applications. The TE0808 series represents their UltraSoM+ line, designed for scalability and integration of AMD Zynq UltraScale+ MPSoCs. This product family supports rapid prototyping through mass production, offering flexible memory configurations and robust connectivity solutions for complex embedded designs.
Publicly confirmed direct substitutes are not available in the provided source material. Designers should evaluate other Trenz Electronic TE08xx series modules based on specific processing performance and memory requirements. Cross-compatibility with carrier boards must be verified manually due to potential differences in connector layouts and pin definitions across different module variants.