TE0808-04-15EG-1EE

TE0808-04-15EG-1EE

  • Description:IC MODULE ZYNQ USCALE 2GB 128MB
  • Series:TE0808

SKU:f412131f0962 Category: Brand:

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Product Detailed Parameters

  • Description:IC MODULE ZYNQ USCALE 2GB 128MB
  • Series:TE0808
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU15EG-1FFVC900E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:B2B
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0808-04-15EG-1EE

Overview

The TE0808-04-15EG-1EE is an industrial-grade System on Module integrating a Xilinx Zynq UltraScale+ ZU9EG MPSoC. It features up to 8 GBytes of DDR4 SDRAM via a 64-bit data bus and dual SPI Flash memory with a maximum capacity of 512 MByte. The module provides 20 Gigabit transceivers (4 GTR, 16 GTH) and extensive I/Os including 65 PS MIOs and 204 PL GPIOs. It operates within a compact 52 x 76 mm form factor.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ ZU9EG MPSoC with heterogeneous processing system and programmable logic
  • Supports up to 8 GBytes of DDR4 SDRAM and dual parallel SPI boot flash configurations
  • Includes onboard Si5345A programmable PLL clock generator with ten outputs
  • Features four high-speed Board-to-Board connectors with ultra-fine pitch contacts

Applications

  • Industrial automation and control systems requiring high-performance embedded processing
  • High-speed data acquisition and precision measurement applications
  • Embedded digital signal processing systems based on FPGA and CPU architectures
  • Automotive and high-end application modules requiring ruggedized form factors

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production status documentation. Confirm that the required pinout configuration matches the baseboard design, particularly regarding B2B connector stacking heights and voltage levels. Ensure compliance with environmental regulations such as RoHS for the intended deployment region.

Selection Notes

Select this module when a high-density MPSoC solution is required within a 5.2 x 7.6 cm footprint. It is suitable for designs needing significant memory bandwidth and multiple high-speed serial interfaces. Consider the onboard power management complexity if custom voltage rails are necessary beyond the standard single 3.3V input requirement.

Part Context

This module belongs to the Trenz Electronic TE0808 series, which utilizes the Xilinx Zynq UltraScale+ MPSoC family. The series includes various variants differentiated by memory capacity and processor speed grades. The TE0808-04 specifically denotes the configuration supporting up to 8 GBytes of DDR4 memory.

Replacement Considerations

Publicly confirmed substitutes include other Trenz Electronic modules in the TE0808 series with different memory densities or processor grades. Direct cross-manufacturer replacements require careful evaluation of pin compatibility and thermal constraints due to the proprietary B2B connector layout.

TE0808-04-15EG-1EETE0808-04-15EG-1EE

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