TE0808-04-6BE21-A

TE0808-04-6BE21-A

  • Description:IC MODULE ZYNQ USCALE 4GB 128MB
  • Series:TE0808

SKU:fdbd790ae672 Category: Brand:

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Product Detailed Parameters

  • Description:IC MODULE ZYNQ USCALE 4GB 128MB
  • Series:TE0808
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU6EG-1FFVC900E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:B2B
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0808-04-6BE21-A

Overview

The Trenz Electronic TE0808-04-6BE21-A is an industrial-grade System on Module integrating a Xilinx Zynq UltraScale+ XCZU9EG MPSoC. It features up to 8 GBytes of DDR4 SDRAM via a 64-bit data bus and supports dual SPI boot Flash with up to 512 MByte capacity. The module provides 20 Gigabit transceivers, including 4 GTR and 16 GTH lanes, alongside extensive configurable I/Os. It operates within a compact 5.2 x 7.6 cm form factor.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ XCZU9EG MPSoC with heterogeneous processing system and programmable logic
  • Supports up to 8 GBytes of DDR4 SDRAM connected via a 64-bit wide data bus
  • Includes onboard Si5345A programmable PLL clock generator with ten outputs
  • Features four Board-to-Board connectors with 160 contacts each for high-speed signal routing

Applications

  • Industrial automation and control systems requiring embedded digital signal processing
  • High-speed data acquisition applications utilizing the FPGA fabric
  • Precision measurement systems leveraging the integrated processing capabilities
  • Embedded networking solutions using the available Gigabit transceivers

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production list to confirm availability status. The TE0808 series documentation indicates that certain variants may be discontinued or subject to change. Confirm the exact memory configuration and package type required for your design before procurement. Ensure compatibility with baseboard power delivery specifications.

Selection Notes

Select this module when a high-performance MPSoC with significant PL resources is required in a compact footprint. The XCZU9EG package offers substantial I/O density and transceiver bandwidth. Consider the onboard power management architecture, which requires a single 3.3V input but utilizes multiple internal regulators. Evaluate the baseboard connector stacking height and signal integrity requirements for the 0.50 mm pitch B2B interfaces.

Part Context

This component belongs to the Trenz Electronic TE0808 family of MPSoC modules based on the Xilinx Zynq UltraScale+ architecture. The family targets industrial and high-reliability applications, offering various memory configurations and processor grades within the same physical form factor. These modules are designed to accelerate development cycles by providing a complete, tested SoM solution.

Replacement Considerations

Publicly confirmed direct substitutes are not identified in the provided documentation. Designers should evaluate other Trenz Electronic TE08xx series modules if pin compatibility is critical, though processor performance and memory capacities will vary. Cross-referencing with Xilinx's broader MPSoC portfolio may reveal functional equivalents requiring significant baseboard redesign.

TE0808-04-6BE21-ATE0808-04-6BE21-A

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