TE0808-04-6BE21-AK

TE0808-04-6BE21-AK

$1,008.11
  • Description:IC MOD SOM MPSOC 4GB ZU6EG
  • Series:TE0808

SKU:740ccd31a403 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MOD SOM MPSOC 4GB ZU6EG
  • Series:TE0808
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU6EG-1FFVC900E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:B2B
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0808-04-6BE21-AK

Overview

The TE0808-04-6BE21-AK is an industrial-grade System on Module integrating a Xilinx Zynq UltraScale+ ZU9EG MPSoC. It features up to 8 GBytes of DDR4 SDRAM via a 64-bit data bus and dual SPI Flash memory totaling 512 MByte for configuration. The module includes twenty Gigabit transceivers (four GTR and sixteen GTH) and extensive I/Os accessible through four 160-pin Board-to-Board connectors. Onboard power management utilizes fourteen DC-DC regulators and thirteen LDOs, requiring only a single 3.3V source.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ ZU9EG MPSoC with programmable logic and processing system
  • Supports up to 8 GBytes of DDR4 SDRAM and dual parallel SPI boot Flash
  • Includes Si5345A programmable PLL clock generator with ten outputs
  • Provides comprehensive onboard power regulation from a single 3.3V input

Applications

  • Industrial automation controllers requiring high-performance processing
  • Medical imaging systems needing reliable embedded computing
  • Telecommunications infrastructure equipment
  • Test and measurement instrumentation platforms

Procurement Notes

Verify the specific hardware revision and component availability directly with Trenz Electronic or authorized distributors. Confirm that the baseboard design accommodates the required 3.3V power input specifications and connector stacking heights. Ensure compliance with environmental regulations such as RoHS and REACH for the intended deployment region.

Selection Notes

Select this module when a compact form factor is required alongside significant processing power and high-speed serial connectivity. The integrated memory and clock generation simplify baseboard design by reducing external component count. Consider the thermal requirements of the ZU9EG package and ensure adequate heat dissipation solutions are implemented on the carrier board.

Part Context

This part belongs to the TE0808 family of System on Modules designed for rugged applications. It leverages the Zynq UltraScale+ architecture to combine ARM Cortex processors with FPGA fabric. The module is engineered for long-term availability in industrial sectors where stability and performance are critical.

Replacement Considerations

No public confirmed substitutes are identified within the provided documentation. Alternative modules may require significant baseboard redesign due to differences in pinout, power distribution, and memory configurations.

TE0808-04-6BE21-AKTE0808-04-6BE21-AK
$1,008.11
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