TE0808-04-9BE21-A

TE0808-04-9BE21-A

  • Description:IC MODULE ZYNQ USCALE 4GB 128MB
  • Series:TE0808

SKU:e20f0759b19d Category: Brand:

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Product Detailed Parameters

  • Description:IC MODULE ZYNQ USCALE 4GB 128MB
  • Series:TE0808
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU9EG-1FFVC900E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:B2B
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0808-04-9BE21-A

Overview

The Trenz Electronic TE0808-04-9BE21-A is an industrial-grade System on Module integrating a Xilinx Zynq UltraScale+ XCZU9EG MPSoC. It features up to 8 GBytes of DDR4 SDRAM via a 64-bit data bus and dual SPI Flash memory totaling 512 MByte for configuration. The module provides 20 Gigabit transceivers (4 GTR, 16 GTH) and extensive I/Os including 65 PS MIOs and 204 PL GPIOs. It operates within a compact 52 x 76 mm form factor with four 160-pin Board-to-Board connectors.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ XCZU9EG MPSoC with heterogeneous processing system and programmable logic
  • Supports up to 8 GBytes of DDR4 SDRAM and dual parallel boot SPI Flash memory
  • Includes Si5345A programmable PLL clock generator with multiple differential outputs
  • Features rugged high-speed stacking connections for extensive signal routing

Applications

  • Industrial automation and control systems requiring embedded digital signal processing
  • High-speed data acquisition and precision measurement applications
  • Automotive infotainment and advanced driver assistance systems
  • Wireless infrastructure and baseband processing units

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production list to ensure component availability and revision alignment. Confirm that the required pinout and connector specifications match the baseboard design constraints. Check for any updates in the technical reference manual regarding power sequencing or thermal requirements before finalizing procurement.

Selection Notes

Select this module when a high-performance MPSoC with significant memory capacity and extensive high-speed serial interfaces is required. Ensure the baseboard design supports the necessary power domains and voltage levels for the Zynq UltraScale+ architecture. Consider the available I/O banks and transceiver lanes to determine if the module meets the specific connectivity needs of the application.

Part Context

Trenz Electronic GmbH specializes in FPGA and CPU-based embedded systems, offering development services and turnkey designs. The TE0808 series represents their modules utilizing Xilinx Zynq UltraScale+ technology, designed for demanding industrial and automotive environments. This specific model is part of their 5.2 x 7.6 cm form factor lineup, providing a balance of performance and compactness.

Replacement Considerations

Consult the official Trenz Electronic documentation for confirmed substitute models within the TE0808 series or other compatible SoM families. Verify mechanical compatibility and pinout equivalence before considering alternatives from different manufacturers.

TE0808-04-9BE21-ATE0808-04-9BE21-A

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