TE0808-04-9BE21-AK

Overview

The TE0808-04-9BE21-AK is an industrial-grade System on Module integrating a Xilinx Zynq UltraScale+ XCZU9EG MPSoC. It features up to 8 GBytes of DDR4 SDRAM via a 64-bit data bus and dual SPI Flash memory with a maximum capacity of 512 MByte. The module provides 20 Gigabit transceivers, including four GTR and sixteen GTH lanes, alongside extensive configurable I/Os accessible through four 160-pin Board-to-Board connectors.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ XCZU9EG MPSoC with programmable logic and processing system
• Supports up to 8 GBytes of DDR4 SDRAM and dual parallel SPI boot Flash
• Includes onboard Si5345A programmable PLL clock generator with ten outputs
• Features complete onboard power management with multiple DC-DC regulators and LDOs

Applications

• Industrial automation and control systems requiring high-performance processing
• Medical imaging devices needing robust real-time data handling
• Telecommunications infrastructure utilizing high-speed serial transceivers
• Test and measurement equipment requiring precise clock generation

Procurement Notes

Verify the specific hardware revision and component variants against the current Technical Reference Manual. Confirm that the baseboard design accommodates the required 3.3V single power source input and supports the necessary B2B connector stacking heights. Ensure compliance with RoHS3 standards for environmental regulations.

Selection Notes

Select this module when a compact form factor is required alongside significant processing power and memory bandwidth. It is suitable for designs needing flexible clock distribution via the onboard Si5345A. Consider the available PL HP GPIOs and MGT lanes for high-speed interface requirements.

Part Context

This part belongs to the TE0808 series of System on Modules manufactured by Trenz Electronic GmbH. These modules are designed to simplify the integration of Xilinx Zynq UltraScale+ MPSoCs into custom carrier boards. The series offers various memory configurations and processor grades within a standardized 52 x 76 mm footprint.

Replacement Considerations

Publicly confirmed direct substitutes are not identified in the provided documentation. Designers should evaluate other Trenz Electronic modules based on pin compatibility and performance requirements if alternative processors are needed.