TE0808-04-BBE21-A

Overview

The Trenz Electronic TE0808-04-BBE21-A is an industrial-grade System on Module integrating a Xilinx Zynq UltraScale+ XCZU9EG MPSoC. It features up to 8 GBytes of DDR4 SDRAM via a 64-bit data bus and dual SPI Flash memory with a maximum capacity of 512 MByte. The module provides 20 Gigabit transceivers (4 GTR + 16 GTH) and extensive I/Os including 65 PS MIOs, 48 PL HD GPIOs, and 156 PL HP GPIOs. It operates within a compact 5.2 x 7.6 cm form factor and includes onboard power management with 14 DC-DC regulators and 13 LDOs.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ XCZU9EG MPSoC with heterogeneous processing system and programmable logic
• Supports up to 8 GBytes of DDR4 SDRAM and dual parallel boot SPI Flash configuration
• Includes Si5345A programmable PLL clock generator with multiple differential outputs
• Features four high-speed Board-to-Board connectors for rugged interconnectivity

Applications

• High-performance embedded digital signal processing systems
• Industrial automation and process control applications
• Precision measurement and data acquisition equipment
• Automotive infotainment and telematics modules

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production list to ensure availability and hardware revision alignment. Confirm that the baseboard design supports the required 3.3V single power source input and matches the B2B connector pinout specifications. Check for any mandatory firmware or OTP programming requirements for the onboard Si5345 clock generator prior to deployment.

Selection Notes

Select this module when a high-density MPSoC solution is required within a small footprint. It is suitable for designs needing significant PL resources and high-speed serial connectivity. Ensure the application can accommodate the thermal requirements of the XCZU9EG package and that the baseboard provides adequate decoupling for the multiple independent power domains.

Part Context

This module belongs to the Trenz Electronic TE0808 series, which utilizes the 5.2 x 7.6 cm form factor. It is part of the company's portfolio of SoM products designed for demanding industrial and automotive environments. The series typically pairs with carrier boards like the TEB0724 to facilitate rapid prototyping and final product integration.

Replacement Considerations

Publicly confirmed direct substitutes are not available in the provided documentation. Design changes may be necessary if migrating to other MPSoC families due to differences in pinouts, power domain architectures, and peripheral configurations.