TE0808-05-6BE21-F

TE0808-05-6BE21-F

$923.11
  • Description:ULTRASOM+ MPSOC MODULE WITH AMD
  • Series:-

SKU:2aa029144b92 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:ULTRASOM+ MPSOC MODULE WITH AMD
  • Series:-
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq™ UltraScale+™ ZU6EG-1FFVC900E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:Board-to-Board (BTB) 4 x 160 Pin
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0808-05-6BE21-F

Overview

The TE0808-05-6BE21-F is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates the Xilinx Zynq UltraScale+ MPSoC architecture, combining programmable logic with quad-core ARM Cortex-A53 and dual-core Cortex-R5 processors. The module includes integrated DDR4 memory and flash storage, providing a compact solution for complex processing tasks requiring both real-time control and advanced data handling capabilities.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ MPSoC with ARM Cortex-A53 and R5 cores
  • Includes on-board DDR4 SDRAM and non-volatile flash memory
  • Supports multiple high-speed interfaces including PCIe, USB 3.0, and Ethernet
  • Compact form factor suitable for space-constrained industrial designs

Applications

  • Industrial automation and machine control systems
  • Medical imaging and diagnostic equipment
  • Automotive infotainment and telematics units
  • Edge computing and IoT gateway devices

Procurement Notes

Verify the specific suffix configuration against official Trenz Electronic documentation to ensure compatibility with required peripherals and interface standards. Confirm RoHS compliance status and check for any recent Product Change Notifications that may affect pinout or component sourcing before finalizing procurement plans.

Selection Notes

Select this module when a combined FPGA and processor solution is required within a small footprint. Evaluate thermal management requirements based on the specific workload distribution between the programmable logic and processing system. Ensure the carrier board design supports the necessary power sequencing and signal integrity for high-speed memory and peripheral interfaces.

Part Context

This part belongs to the TE0808 family of modules from Trenz Electronic, which are built around Xilinx Zynq UltraScale+ MPSoC devices. These modules are engineered to accelerate development cycles by providing a pre-validated hardware platform that reduces risk associated with complex SoC integration and layout challenges.

Replacement Considerations

Direct replacements are limited due to the proprietary nature of the module integration. Consider other Trenz Electronic SOMs in the TE0808 series if different memory capacities or interface options are needed. For architectural changes, evaluate competing Zynq-based modules from other vendors, ensuring software compatibility and pinout mapping differences are addressed.

TE0808-05-6BE21-FTE0808-05-6BE21-F
$923.11
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