TE0808-05-6BE81-EK

Overview

The KK0808-05 is a heat spreader manufactured by Trenz Electronic, designed specifically for the TE0808-05 MPSoC module. This component serves as a thermal management accessory to dissipate heat generated by the system-on-module. It utilizes a screw mounting style for secure attachment to the module's surface. The product is classified under heat sinks and is intended to maintain optimal operating temperatures for the embedded processing unit during high-performance operations.

Feature Summary

• Designed exclusively for the TE0808-05 MPSoC module
• Utilizes screw mounting for secure installation
• Functions as a dedicated heat spreader for thermal dissipation

Applications

• Thermal management for Xilinx Zynq UltraScale+ MPSoC modules
• Embedded systems requiring stable operating temperatures
• Industrial control boards utilizing Trenz Electronic SoMs

Procurement Notes

Verify compatibility with the specific TE0808-05 module variant before integration. Confirm that the screw mounting interface aligns with the mechanical design of the target carrier board or enclosure. Ensure the heat spreader is sourced directly from authorized distributors to guarantee authenticity and adherence to Trenz Electronic specifications.

Selection Notes

Select this component only when active cooling or enhanced thermal conduction is required for the TE0808-05 module. Consider the mechanical constraints of the screw mounting method during PCB layout and enclosure design. Evaluate if the thermal performance meets the application's power dissipation requirements compared to passive heatsink alternatives.

Part Context

Trenz Electronic specializes in FPGA and SoC modules for industrial applications. The TE0808-05 is part of their MPSoC portfolio, leveraging Xilinx technology. The KK0808-05 is an accessory within this ecosystem, providing necessary thermal support to ensure reliability in demanding embedded environments where heat accumulation could impact performance.