TE0808-05-9BE21-L

Overview

The TE0808-05-9BE21-L is a heat spreader manufactured by Trenz Electronic, specifically engineered for the TE0808-05 MPSoC module. This passive thermal management component utilizes a screw-mount installation style to ensure secure attachment and efficient heat dissipation from the processor die. Designed as an accessory within the Trenz Electronic ecosystem, it serves to maintain optimal operating temperatures for high-performance computing applications involving Xilinx Zynq UltraScale+ MPSoC devices.

Feature Summary

• Specifically designed thermal interface solution for the TE0808-05 MPSoC module
• Utilizes screw-mount installation for robust mechanical stability and thermal contact
• Passive heat spreading technology to enhance thermal performance of the SoC

Applications

• Thermal management for Trenz Electronic TE0808-05 based embedded systems
• High-performance industrial computing platforms requiring reliable SoC cooling
• Automotive infotainment or ADAS modules utilizing Zynq MPSoC architectures
• Medical imaging equipment with strict thermal constraints on processing units

Procurement Notes

Verify compatibility with the specific TE0808-05 module variant before integration. Confirm that the mounting hardware aligns with the carrier board design. Ensure the heat spreader surface is prepared according to thermal interface material requirements if applicable. Check for RoHS compliance status in the latest datasheet.

Selection Notes

Select this component only when using the Trenz Electronic TE0808-05 module. It is not a universal heat sink but a form-factor specific accessory. Consider the thermal resistance of the interface material used between the chip and the spreader. Evaluate airflow conditions in the final enclosure to determine if active cooling is also required alongside this passive solution.

Part Context

This part belongs to the accessory line of Trenz Electronic, focusing on thermal solutions for their custom MPSoC modules. The TE0808 series integrates Xilinx Zynq UltraScale+ MPSoC technology. The heat spreader is a critical peripheral component ensuring long-term reliability of the core processing unit under load.