TE0808-05-9BE81-AK

Overview

The TE0808-05-9BE81-AK is a System-on-Module manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates an AMD Zynq UltraScale+ MPSoC with integrated RF capabilities and DDR4 memory. The module supports industrial operating temperatures ranging from -40°C to +85°C and features multiple high-speed interfaces including PCIe, USB, and Ethernet. Its compact form factor facilitates integration into space-constrained designs requiring significant processing power and connectivity.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC with RFSoC architecture
• Supports industrial temperature range for harsh environments
• Includes onboard DDR4 memory for high-bandwidth data processing
• Provides diverse high-speed peripheral interfaces for system expansion

Applications

• Industrial automation and control systems
• Wireless communication infrastructure
• Medical imaging devices
• Aerospace and defense avionics
• Test and measurement equipment

Procurement Notes

Verify the specific revision level and manufacturing date code against current production status, as component availability may fluctuate. Confirm that the selected variant meets all environmental and regulatory compliance requirements for the target deployment region. Cross-reference the part number with official distributor catalogs to ensure authenticity and traceability before finalizing procurement orders.

Selection Notes

Select this module when a combined FPGA and ARM processor solution with RF capabilities is required. Ensure the host board design accommodates the specific pinout and thermal requirements of the Zynq UltraScale+ architecture. Evaluate memory configuration needs against available onboard DDR4 resources. Consider the mechanical dimensions and mounting options to fit within the enclosure constraints of the final product assembly.

Part Context

This module belongs to the TE0808 family, which utilizes AMD's Zynq UltraScale+ technology. Trenz Electronic specializes in providing robust FPGA and SoM solutions for industrial and scientific markets. The company offers comprehensive support including hardware design files, software drivers, and engineering services to accelerate time-to-market for complex embedded projects.

Replacement Considerations

Direct replacements are limited due to the proprietary integration of the AMD MPSoC and custom PCB layout. Alternative modules from other manufacturers would require significant redesign of the carrier board and software stack. Verify compatibility with existing carrier boards if considering migration to different SoM families within the same ecosystem.