TE0808-05-9BE81-L

TE0808-05-9BE81-L

$1,080.36
  • Description:ULTRASOM+ MPSOC MODULE WITH ZYNQ
  • Series:TE0808

SKU:3986b75ce3c4 Category: Brand:

  
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Product Detailed Parameters

  • Description:ULTRASOM+ MPSOC MODULE WITH ZYNQ
  • Series:TE0808
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:-
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:-
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:-

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TE0808-05-9BE81-L

Overview

The TE0808-05-9BE81-L is a System-on-Module manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates an AMD Zynq UltraScale+ RFSoC FPGA, combining programmable logic with ARM Cortex-A53 and R5 processors alongside integrated RF data converters. The module includes 9 GB of DDR4 memory operating at 2666 MHz to support complex signal processing tasks. This SOM architecture enables compact designs requiring significant computational power and direct RF interface capabilities within a standardized form factor.

Feature Summary

  • Integrates AMD Zynq UltraScale+ RFSoC FPGA with dual-core ARM Cortex-A53 and dual-core Cortex-R5 processors
  • Includes integrated high-speed RF transceivers and ADC/DAC blocks for direct RF sampling applications
  • Equipped with 9 GB DDR4-2666 memory for large data buffer requirements
  • Provides a modular system-on-module design for rapid prototyping and deployment

Applications

  • Software-defined radio systems requiring direct RF conversion
  • Advanced radar and electronic warfare signal processing platforms
  • High-throughput industrial automation and machine vision controllers
  • Telecommunications baseband processing units

Procurement Notes

Verify current availability status as the product may be subject to limited supply or end-of-life conditions. Confirm that the specific suffix indicates the correct memory configuration and temperature grade required for your application. Ensure compatibility with existing carrier board designs before procurement, as pin assignments are specific to this module variant.

Selection Notes

Select this module when high-density memory and integrated RF functionality are required in a single package. Compare against standard Zynq MPSoC modules if RF transceivers are not needed, as those may offer different cost structures. Evaluate thermal management requirements carefully due to the high performance of the RFSoC device. Ensure the host carrier provides sufficient power delivery for the 9 GB DDR4 configuration.

Part Context

This component belongs to the Trenz Electronic TE0808 family of System-on-Modules based on AMD Xilinx Zynq UltraScale+ RFSoC technology. These modules are engineered to simplify the integration of complex FPGA-based systems by providing a pre-validated hardware platform. The family supports various memory configurations and interfaces, catering to diverse industrial and aerospace computing needs.

Replacement Considerations

No public confirmed substitutes are available. As this is a specialized System-on-Module with a unique mechanical and electrical footprint, direct replacements are unlikely. Designers should consider redesigning the carrier board if switching to a different FPGA vendor or module size.

TE0808-05-9BE81-LTE0808-05-9BE81-L
$1,080.36
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