TE0808-05-9GI21-AK

Overview

The TE0808-05-9GI21-AK is a System-on-Module manufactured by Trenz Electronic GmbH, designed for high-performance embedded applications. It integrates the Xilinx Zynq UltraScale+ MPSoC architecture, combining programmable logic with processing systems. The module features integrated memory and interfaces suitable for industrial and automotive environments. Manufactured in Germany, it supports complex digital signal processing and data acquisition tasks within a compact form factor.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC for combined FPGA and ARM processor capabilities
• Designed for industrial and automotive embedded applications
• Compact system-on-module form factor for space-constrained designs
• Manufactured in Germany with comprehensive engineering support

Applications

• High-speed data acquisition systems
• Embedded digital signal processing
• Automotive infotainment and control units
• Industrial process control and measurement systems

Procurement Notes

Verify component authenticity through authorized Trenz Electronic distributors or direct channels. Confirm revision compatibility with existing baseboards, as mechanical and electrical pinouts may vary between revisions. Request current lifecycle status documentation to ensure long-term availability for production planning. Validate that the specific suffix matches required performance grades and temperature ranges.

Selection Notes

Select this module when requiring high computational density in a small footprint. Ensure the host carrier board supports the specific I/O voltage levels and interface speeds of the Zynq UltraScale+ MPSoC. Consider thermal management requirements due to the high power density of the SoC. Verify software toolchain compatibility with the specific silicon revision and memory configuration.

Part Context

Trenz Electronic specializes in FPGA and SoC modules for demanding industrial and automotive sectors. The TE0808 series represents their MPSoC offerings, leveraging Xilinx technology for versatile computing needs. This module is part of a broader ecosystem including baseboards and development kits, facilitating rapid prototyping and deployment of complex embedded solutions.

Replacement Considerations

No public confirmed substitutes are available. Alternative solutions require redesigning the carrier board and updating firmware. Evaluate other Trenz Electronic MPSoC modules if pinout compatibility is not critical. Consult manufacturer engineering services for custom adaptations if exact replacement is necessary.