TE0808-05-9GI81-EK

TE0808-05-9GI81-EK

$1,431.42
  • Description:ULTRASOM+ MPSOC-MODULE WITH AMD
  • Series:-

SKU:c1c149d22246 Category: Brand:

  
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Product Detailed Parameters

  • Description:ULTRASOM+ MPSOC-MODULE WITH AMD
  • Series:-
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:-
  • Core Processor:-
  • Co-Processor:-
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TE0808-05-9GI81-EK

Overview

The TE0808-05-9GI81-EK is a development kit from Trenz Electronic designed for the AMD Xilinx Zynq UltraScale+ RFSoC family. This evaluation platform integrates an RFSoC System-on-Module (SOM) with a carrier board, providing a complete hardware environment for prototyping and validating high-performance radio frequency and digital signal processing applications. The kit facilitates rapid development cycles by offering accessible interfaces for JTAG programming, power delivery, and peripheral connectivity essential for embedded system design.

Feature Summary

  • Integrated RFSoC SOM compatible with AMD Xilinx UltraScale+ architecture
  • Carrier board provides expanded I/O interfaces for peripheral integration
  • Supports high-speed data acquisition and transmission workflows
  • Designed for rapid prototyping of complex embedded systems

Applications

  • Software-defined radio (SDR) development and testing
  • High-speed data acquisition system prototyping
  • Embedded digital signal processing algorithm validation
  • Advanced radar and communication system research

Procurement Notes

Verify component availability through authorized distributors as lead times may vary. Confirm that the specific revision matches project requirements. Ensure compatibility with existing software tools and FPGA bitstreams. Check for any regional distribution restrictions or export control classifications applicable to the RFSoC technology before finalizing procurement plans.

Selection Notes

Select this kit when requiring a complete evaluation environment for Zynq UltraScale+ RFSoC devices rather than standalone modules. It is suitable for engineers needing immediate access to both the processor subsystem and RF front-end capabilities. Consider the form factor and interface density of the carrier board against specific application constraints. Validate that the included SOM variant aligns with the target performance metrics and pinout requirements.

Part Context

Trenz Electronic specializes in modular computing solutions and embedded development services. The TE0808 series represents their evaluation kits built around Xilinx processors. These kits are part of a broader ecosystem including SOMs, baseboards, and FMC cards, aimed at accelerating the deployment of industrial and aerospace-grade embedded systems based on FPGA and SoC technologies.

Replacement Considerations

No direct public substitutes are confirmed for this specific integrated development kit. Alternative approaches involve sourcing individual SOMs and designing custom carrier boards, which requires significant additional engineering effort. Evaluate other vendor-specific RFSoC evaluation platforms if Trenz Electronic products are unavailable, noting differences in software support and hardware compatibility.

TE0808-05-9GI81-EKTE0808-05-9GI81-EK
$1,431.42
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