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The KK0808-05 is a heat spreader manufactured by Trenz Electronic, designed specifically for the TE0808-05 MPSoC modules. This component serves as a thermal management solution to dissipate heat generated by the system-on-module. It utilizes a screw mounting style for secure attachment to the module surface. The product is classified under heat sinks and is intended to maintain optimal operating temperatures for high-performance embedded processing systems.
Verify compatibility with the specific TE0808-05 module variant before integration. Confirm that the screw mounting interface aligns with your mechanical design constraints. Ensure that the thermal performance requirements of the application are met by this specific heat spreader model. Check for any RoHS compliance documentation if required for your manufacturing process.
Select this component when using the Trenz Electronic TE0808-05 module and active cooling via a heat spreader is required. It is not a universal heatsink but is tailored for the specific form factor and thermal profile of the TE0808-05. Consider mechanical clearance and screw hole alignment during the PCB layout phase.
Trenz Electronic specializes in development services and turnkey designs for embedded systems, particularly those involving FPGA and CPU architectures. The TE0808-05 is part of their MPSoC module lineup, which integrates Xilinx Zynq UltraScale+ technology. This heat spreader is an accessory component within their broader ecosystem of modules, carrier boards, and development tools.