TE0808-05-BBE81-A

Overview

The KK0808-05 is a heat spreader accessory manufactured by Trenz Electronic, specifically engineered for the TE0808-05 MPSoC module. This component serves as a thermal management solution designed to dissipate heat generated by the system-on-module. It utilizes a screw-mount installation style to ensure secure attachment and effective thermal contact with the module's processor die.

Feature Summary

• Designed exclusively for the TE0808-05 MPSoC module
• Screw-mount installation for secure thermal interface
• Acts as a primary heat spreader for high-performance processing

Applications

• Thermal management for Xilinx Zynq UltraScale+ MPSoC modules
• Embedded systems requiring reliable heat dissipation
• Industrial control hardware utilizing Trenz Electronic SoMs

Procurement Notes

Verify compatibility with the specific TE0808-05 module variant before integration. Confirm that the mounting hardware aligns with the mechanical design of the target carrier board or enclosure. Ensure the thermal interface material selection complements the heat spreader's surface characteristics for optimal performance.

Selection Notes

Select this component when active cooling or enhanced passive thermal dissipation is required for the TE0808-05 module. It is intended for use in environments where maintaining junction temperatures within safe operating limits is critical for long-term reliability and sustained computational performance.

Part Context

This heat spreader is part of Trenz Electronic's ecosystem of accessories for their System-on-Module products. The TE0808-05 series represents modules based on Xilinx Zynq UltraScale+ MPSoC technology, combining ARM processors with FPGA fabric. The KK0808-05 ensures these high-density components operate reliably under load.