TE0813-01-2BE11-A

Overview

The TE0813-01-2BE11-A is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC processor with integrated DDR4 memory. The module provides a compact form factor suitable for space-constrained designs, offering high-performance processing capabilities combined with programmable logic resources within a single package.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC architecture
• Includes onboard DDR4 memory for data processing
• Compact System-on-Module form factor for embedded integration
• Supports rapid prototyping and production deployment

Applications

• Industrial automation control systems
• Medical device embedded processing
• Aerospace and defense avionics
• Test and measurement equipment

Procurement Notes

Verify current availability status directly with the manufacturer or authorized distributors, as supply chain conditions may vary. Confirm that the specific suffix matches the required processor speed grade and memory configuration. Ensure compatibility with baseboard designs regarding pinout and power requirements before procurement.

Selection Notes

Select this module when a combination of ARM Cortex-A53 processing and FPGA fabric is required in a small footprint. Consider the thermal management solutions available from Trenz Electronic if operating in high-load scenarios. Verify that the baseboard design supports the necessary I/O interfaces provided by the MPSoC.

Part Context

This component belongs to the Trenz Electronic SOM portfolio, which specializes in modules based on AMD, Altera, and Microchip technologies. The company provides comprehensive support including hardware, software, and design-in assistance for engineers developing embedded solutions ranging from prototypes to mass production.

Replacement Considerations

No public confirmed substitutes are listed in the provided documentation. Engineers should consult Trenz Electronic for potential alternative modules within the same family or next-generation replacements that maintain compatible mechanical and electrical interfaces.