TE0813-01-3AE11-A

Overview

The TE0813-01-3AE11-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC device, specifically the ZU3EG variant, providing combined FPGA and ARM processor capabilities. The module includes 2 GByte of DDR4 memory to support high-bandwidth data processing tasks. Physically, the module measures 5.2 x 7.6 cm, offering a compact form factor suitable for space-constrained industrial and commercial designs requiring scalable processing power.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC with ZU3EG device for mixed FPGA and processor functionality
• Includes 2 GByte DDR4 memory for efficient data handling
• Compact 5.2 x 7.6 cm form factor for space-efficient integration

Applications

• Industrial automation controllers requiring real-time processing
• Medical imaging devices needing flexible hardware acceleration
• Communication infrastructure equipment with mixed signal processing needs
• Test and measurement instruments requiring programmable logic

Procurement Notes

Verify current availability status directly with Trenz Electronic or authorized distributors, as supply conditions may vary. Confirm that the specific suffix AE11 corresponds to the required temperature range and package configuration for your application environment. Ensure compatibility with baseboard designs supporting the specified module dimensions and pinout requirements before procurement.

Selection Notes

Select this module when an integrated solution combining FPGA fabric and ARM processors is required within a small footprint. The ZU3EG device offers sufficient resources for moderate complexity logic designs while providing dual-core ARM Cortex-A53 processing. Consider thermal management solutions appropriate for the enclosed system environment, as the module generates heat during active operation.

Part Context

This component belongs to the Trenz Electronic SOM portfolio, which specializes in modular embedded systems based on major FPGA manufacturers' platforms. The TE0813 series utilizes AMD Xilinx technology, targeting engineers who need rapid prototyping and production-ready modules. These modules simplify the integration of complex SoC technologies into custom carrier boards by providing pre-validated hardware foundations.

Replacement Considerations

No publicly confirmed direct substitutes are available in the provided documentation. Engineers should evaluate other Trenz Electronic SOMs based on similar AMD Zynq UltraScale+ devices or consult manufacturer guidelines for pin-compatible alternatives within the same product family.