TE0813-01-3BE11-A

TE0813-01-3BE11-A

$442.79
  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:Zynq® UltraScale+™

SKU:ebe2f243df87 Category: Brand:

  
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Product Detailed Parameters

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:Zynq® UltraScale+™
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU3EG-1SFVC784E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:Board-to-Board (BTB) Socket - 240
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0813-01-3BE11-A

Overview

The Trenz Electronic TE0813-01-3BE11-A is an industrial-grade System-On-Module (SOM) integrating the AMD Xilinx Zynq UltraScale+ ZU3EG-1E MPSoC. It features 2 GByte of DDR4 SDRAM and 128 MByte of flash memory for configuration and operation. The module operates within a temperature range of 0°C to +85°C, ensuring thermal stability in demanding environments. Its physical dimensions are standardized at 52 mm x 76 mm, facilitating integration into compact embedded designs.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ MPSoC with ZU3EG processor core
  • Includes 2 GByte DDR4 SDRAM and 128 MByte flash memory
  • Industrial-grade design supporting wide operating temperatures

Applications

  • Industrial automation control systems
  • Embedded computing platforms requiring high reliability
  • IoT gateways and edge processing nodes

Procurement Notes

Verify the specific suffix codes against official Trenz Electronic documentation to ensure correct memory capacity and temperature rating. Confirm that the ZU3EG-1E variant matches the target application's performance requirements. Check current supply status as availability may fluctuate. Ensure compatibility with carrier board interfaces before procurement.

Selection Notes

Select this module when a robust industrial SOM with integrated FPGA and ARM cores is required. It is suitable for applications needing significant logic resources alongside processing power. Consider the 52x76mm form factor for space-constrained enclosures. Evaluate if the 2GB DDR4 capacity meets data throughput needs compared to higher-capacity alternatives.

Part Context

This component belongs to the UltraSOM family of system-on-modules by Trenz Electronic. These modules are designed to simplify the development of complex embedded systems by providing a pre-validated hardware platform. The series supports various Xilinx Zynq UltraScale+ devices, offering scalability across different performance tiers while maintaining consistent mechanical and electrical interfaces.

Replacement Considerations

TE0813-01-3AE11-A is a related variant within the same product line. Verify pin compatibility and software support when considering substitutes. No other direct public substitutes are confirmed.

TE0813-01-3BE11-ATE0813-01-3BE11-A
$442.79
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