TE0813-01-4AE11-A

TE0813-01-4AE11-A

$433.25
  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:Zynq® UltraScale+™

SKU:a09282cf2c71 Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:Zynq® UltraScale+™
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU4CG-1SFVC784E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:Board-to-Board (BTB) Socket - 240
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:0°C ~ 85°C

Download product information

TE0813-01-4AE11-A

Overview

The TE0813-01-4AE11-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC processor with integrated DDR4 memory and flash storage. The module supports high-speed interfaces including PCIe, USB 3.0, Ethernet, and SATA, enabling versatile connectivity for industrial and commercial systems. Operating within a temperature range of -40°C to +85°C, it ensures reliability in demanding environments.

Feature Summary

  • Integrates AMD Zynq UltraScale+ MPSoC for combined processing and programmable logic capabilities
  • Supports multiple high-speed peripheral interfaces including PCIe and USB 3.0
  • Designed for extended industrial temperature operation ranges

Applications

  • Industrial automation controllers requiring real-time processing
  • Medical imaging devices needing high-bandwidth data transfer
  • Automotive infotainment systems with display output requirements
  • Telecommunications infrastructure equipment

Procurement Notes

Verify current availability status as this component may be subject to discontinuation or limited supply. Confirm compatibility with baseboard designs through official documentation. Check for any product change notifications that might affect pinout or electrical characteristics before finalizing procurement plans.

Selection Notes

Select this module when both ARM processing and FPGA programmability are required in a compact form factor. Ensure the application benefits from the integrated memory architecture. Verify that the available I/O interfaces meet system connectivity needs without requiring additional external bridges.

Part Context

This part belongs to Trenz Electronic's TE0813 series of SOMs based on Xilinx/AMD Zynq UltraScale+ technology. These modules are engineered to simplify integration of complex SoC designs into custom carrier boards while maintaining standard mechanical footprints for easy adoption in existing product lines.

Replacement Considerations

No direct public substitutes are confirmed. Evaluate newer generations of Zynq MPSoC modules from Trenz Electronic or alternative vendors if this specific package size or interface configuration is unavailable. Ensure functional equivalence in terms of I/O count and memory capacity.

TE0813-01-4AE11-ATE0813-01-4AE11-A
$433.25
Buy Now