TE0813-01-5DE11-A

TE0813-01-5DE11-A

$1,077.40
  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:Zynq® UltraScale+™

SKU:b37b29eb4061 Category: Brand:

  
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Product Detailed Parameters

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:Zynq® UltraScale+™
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU5EV-1SFVC784E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:Board-to-Board (BTB) Socket - 240
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0813-01-5DE11-A

Overview

The TE0813-01-5DE11-A is a System-on-Module (SOM) manufactured by Trenz Electronic GmbH, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ RFSoC device, combining programmable logic with processing system capabilities. The module includes integrated DDR4 memory and supports high-speed data acquisition through its RF transceivers. It features rugged board-to-board connectors to interface with carrier boards, providing access to the FPGA's serial transceivers and general-purpose I/Os for versatile industrial and communication system deployments.

Feature Summary

  • Integrates AMD Zynq UltraScale+ RFSoC for combined signal processing and control
  • Includes onboard DDR4 memory for high-bandwidth data handling
  • Features rugged stacking connectors supporting numerous high-speed transceiver I/Os
  • Supports flexible power management via integrated DC/DC converters and LDO regulators

Applications

  • Software-defined radio systems
  • High-speed data acquisition platforms
  • Advanced radar signal processing
  • Telecommunications infrastructure equipment

Procurement Notes

Verify the specific silicon grade and memory configuration against the official datasheet before integration. Confirm that the required RF performance specifications align with the installed RFSoC variant. Check for any product change notifications or end-of-life announcements from Trenz Electronic regarding this specific model number to ensure long-term supply stability.

Selection Notes

Select this module when both high-throughput digital signal processing and complex control logic are required in a compact form factor. It is suitable for designs needing direct RF input/output capabilities without external ADC/DAC interfaces. Ensure the carrier board design can accommodate the pin density of the rugged stacking connectors and provides adequate thermal management for the SoC.

Part Context

This component belongs to the TE0813 series of System-on-Modules from Trenz Electronic. These modules are engineered to simplify the adoption of Xilinx/AMD Zynq UltraScale+ RFSoC technology. They provide a pre-validated hardware platform that reduces development time for complex embedded systems requiring mixed-signal processing capabilities.

TE0813-01-5DE11-ATE0813-01-5DE11-A
$1,077.40
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