TE0813-01-5DI21-A

TE0813-01-5DI21-A

$1,315.98
  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:Zynq® UltraScale+™

SKU:d82063335556 Category: Brand:

  
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Product Detailed Parameters

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:Zynq® UltraScale+™
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU5EV-1SFVC784I
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:Board-to-Board (BTB) Socket - 240
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0813-01-5DI21-A

Overview

The TE0813-01-5DI21-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Xilinx Zynq UltraScale+ MPSoC (XCZU5EV-1SFVC784I) with 2 GB of DDR4 SDRAM and 128 MB of flash memory. The module operates within a temperature range of -40°C to +85°C and features interfaces including DisplayPort, eMMC, GMII, I2C, JTAG, PCIe, QSPI, SATA, and USB 3.0.

Feature Summary

  • Integrates AMD Xilinx Zynq UltraScale+ MPSoC for combined processing and programmable logic capabilities
  • Supports industrial operating temperatures from -40°C to +85°C
  • Includes high-speed connectivity via PCIe, SATA 3.1, and USB 3.0 interfaces

Applications

  • Industrial automation and control systems requiring robust embedded processing
  • High-performance data acquisition and signal processing applications
  • Automotive infotainment or telematics units utilizing MPSoC capabilities
  • Medical imaging devices requiring real-time data processing

Procurement Notes

This component is listed as End-of-Life (EOL) by the manufacturer. Availability is restricted, and distributors may not stock this item in all regions. Engineers should verify current supply status through official channels before design finalization. Alternative solutions or lifecycle management strategies should be considered due to discontinuation.

Selection Notes

Select this module when a compact form factor (40 mm x 50 mm) is required alongside significant FPGA resources and ARM processor integration. It is suitable for designs needing multiple high-speed serial interfaces and industrial-grade thermal performance. Verify that the specific pinout and interface availability match the target carrier board design requirements.

Part Context

Trenz Electronic specializes in modular system solutions based on FPGA and SoC architectures. The TE0813 series belongs to their lineup of System-on-Modules aimed at providing scalable hardware platforms for complex embedded projects. These modules are often paired with carrier boards to accelerate development cycles for industrial and automotive sectors.

Replacement Considerations

As the TE0813-01-5DI21-A is discontinued, direct replacements must be sourced from the manufacturer's current portfolio or equivalent third-party SOMs. Evaluate newer Trenz Electronic modules featuring updated Zynq UltraScale+ variants or comparable MPSoCs with similar interface counts and memory configurations.

TE0813-01-5DI21-ATE0813-01-5DI21-A
$1,315.98
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