TE0813-02-2BE81-A

TE0813-02-2BE81-A

$352.14
  • Description:MPSOC MODULE WITH AMD ZYNQ ULTRA
  • Series:Zynq UltraScale+

SKU:3e2e2e1412e0 Category: Brand:

  
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Product Detailed Parameters

  • Description:MPSOC MODULE WITH AMD ZYNQ ULTRA
  • Series:Zynq UltraScale+
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:Board-to-Board (BTB) Socket - 4 x 240
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0813-02-2BE81-A

Overview

The TE0813-02-2BE81-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC processor with integrated programmable logic and processing system capabilities. The module provides high-performance processing suitable for complex embedded tasks, featuring extensive I/O interfaces and memory support within a compact form factor optimized for industrial and commercial deployment.

Feature Summary

  • Integrates AMD Zynq UltraScale+ MPSoC architecture combining ARM Cortex processors with FPGA fabric
  • Compact modular design facilitating rapid prototyping and integration into custom carrier boards
  • Supports diverse industrial communication protocols and high-speed data interfaces

Applications

  • Industrial automation and control systems requiring real-time processing
  • Medical imaging devices needing high-throughput data handling
  • Automotive infotainment and telematics units
  • Test and measurement equipment requiring flexible signal processing

Procurement Notes

Verify current availability status as supply conditions may vary. Confirm specific revision levels and manufacturing dates against project requirements. Ensure compatibility with selected carrier board designs before procurement. Check for any end-of-life notifications or discontinuation notices from the manufacturer to mitigate long-term supply risks.

Selection Notes

Select this module when a combined FPGA and ARM processor solution is required in a small footprint. Evaluate thermal management needs based on the specific application load. Ensure the host baseboard supports the required voltage rails and interface standards. Compare pin-out compatibility with existing designs if replacing previous module generations.

Part Context

This component belongs to the TE0813 series of System-on-Modules from Trenz Electronic. The series focuses on AMD Xilinx Zynq UltraScale+ MPSoC technology. These modules are part of a broader ecosystem including evaluation boards and baseboards. They target engineers seeking scalable embedded solutions with hardware programmability.

TE0813-02-2BE81-ATE0813-02-2BE81-A
$352.14
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