TE0813-02-3AE81-A

Overview

The TE0813-02-3AE81-A is a System-on-Module manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates the Xilinx Zynq UltraScale+ MPSoC family, combining dual-core ARM Cortex-A53 processors with quad-core Cortex-R5 real-time cores and programmable logic resources. This module provides a compact form factor suitable for industrial automation, medical devices, and communication infrastructure, offering extensive I/O connectivity and processing capabilities within a single package.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC with ARM Cortex-A53 and R5 cores
• Includes programmable logic fabric for custom hardware acceleration
• Supports multiple high-speed interfaces including PCIe, USB, and Ethernet
• Designed for robust operation in demanding industrial environments

Applications

• Industrial automation and control systems
• Medical imaging and diagnostic equipment
• Telecommunications infrastructure nodes
• Advanced human-machine interfaces (HMI)
• Edge computing gateways

Procurement Notes

Verify component authenticity through authorized Trenz Electronic distributors or direct channels. Confirm RoHS compliance status and specific revision levels against official datasheets prior to integration. Ensure supply chain stability as availability may vary by region. Request detailed technical documentation and pinout diagrams from the manufacturer to validate compatibility with existing carrier board designs.

Selection Notes

Select this module when high processing performance combined with FPGA flexibility is required. Consider the specific memory configuration and interface requirements of the target application. Evaluate thermal management solutions based on the expected workload and environmental conditions. Compare against other modules in the TE081X series to determine the optimal balance between cost, power consumption, and feature set for the specific project needs.

Part Context

This part belongs to the Trenz Electronic TE081X UltraSOM+ family, which utilizes Xilinx Zynq UltraScale+ MPSoC technology. The family offers various configurations tailored for different performance and connectivity requirements. These modules are designed to accelerate time-to-market for complex embedded systems by providing a pre-certified, compact solution that reduces design risk and development effort for engineers.

Replacement Considerations

No publicly confirmed direct substitutes are available. Alternative solutions require evaluating other SoM vendors offering similar Zynq-based architectures. Design changes to the carrier board may be necessary due to differences in pin mapping, power sequencing, and mechanical dimensions. Conduct thorough functional testing to ensure compatibility with existing software drivers and hardware peripherals.