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The TE0813-02-4AE81-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ RFSoC device, specifically the XCZU7EV-2FFVC1924E, which combines programmable logic with processing system capabilities and integrated RF data converters. The module includes 4 GB of DDR4 SDRAM for high-bandwidth memory operations. It supports industrial operating temperatures ranging from -40°C to +85°C and features a compact form factor suitable for space-constrained designs requiring high-performance signal processing.
Verify current availability status as supply chain conditions may affect stock levels. Confirm that the specific suffix denotes the correct package and temperature grade required for your application. Ensure compatibility with baseboard designs regarding pinout and power requirements before procurement.
Select this module when RF sampling capabilities are required alongside FPGA logic resources. Compare against standard MPSoC modules if RF functionality is not needed to optimize cost. Verify that the 4 GB memory configuration meets the buffer requirements for your specific data throughput needs.
This component belongs to the Trenz Electronic SOM portfolio, which provides modular solutions based on major FPGA and SoC vendors. These modules are engineered to accelerate development cycles by offering pre-validated hardware platforms. They serve as core components for custom carrier boards in various industrial and commercial sectors.
No direct public substitutes are confirmed for this specific RFSoC configuration. Consider evaluating other Trenz Electronic modules with similar RFSoC devices or alternative vendor platforms if lead times are critical. Ensure functional equivalence in terms of I/O count and memory bandwidth during substitution planning.