TE0813-02-4DE81-A

Overview

The TE0813-02-4DE81-A is a System-on-Module manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates an AMD Zynq UltraScale+ MPSoC to deliver combined processing system and programmable logic capabilities. The module features integrated DDR4 SDRAM and Flash memory, supporting robust data handling and configuration storage. Designed for industrial environments, it operates within a specified temperature range and includes multiple high-speed interfaces for versatile connectivity in complex system architectures.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC for dual-domain processing
• Includes onboard DDR4 SDRAM and non-volatile Flash memory
• Supports rugged board-to-board stacking connectors for high-density I/O
• Features integrated power delivery subsystem with DC/DC converters and LDO regulators

Applications

• Industrial automation and control systems
• High-speed data acquisition and signal processing
• Medical imaging equipment
• Aerospace and defense avionics
• Test and measurement instrumentation

Procurement Notes

Verify current availability status as the product lifecycle may indicate end-of-life or limited supply conditions. Confirm compatibility with specific baseboards such as the TEBF series. Ensure that the required memory configurations and interface selections match the target application specifications before procurement. Check for any recent discontinuation notifications from Trenz Electronic.

Selection Notes

Select this module when a compact form factor with high computational density is required. Consider the available I/O interfaces and memory capacity relative to the application's bandwidth needs. Evaluate thermal management requirements given the dense integration of the MPSoC. Verify that the operating temperature range aligns with the environmental conditions of the deployment site.

Part Context

Trenz Electronic specializes in embedded solutions based on FPGA and SoC architectures. The TE0813 series represents their UltraSOM+ line, focusing on miniaturization without compromising performance. This module is part of a broader ecosystem including baseboards and development tools, facilitating rapid prototyping and deployment in demanding industrial sectors.

Replacement Considerations

No direct public substitutes are confirmed. Evaluate other modules within the Trenz Electronic UltraSOM+ family or comparable MPSoC-based solutions from other manufacturers if this part is discontinued. Ensure pinout and software compatibility are assessed during any transition planning.