TE0813-02-5DI81-A

Overview

The TE0813-02-5DI81-A is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates an AMD Zynq UltraScale+ MPSoC, specifically the ZU3EG variant, providing combined FPGA and ARM processor capabilities. The module includes 2 GByte of DDR4 SDRAM for data processing and storage. It supports a wide operating temperature range from -40°C to +85°C, ensuring reliability in industrial environments. The form factor measures 40 mm x 50 mm, facilitating integration into compact designs.

Feature Summary

• Integrates AMD Zynq UltraScale+ ZU3EG MPSoC with dual-core ARM Cortex-A53 and dual-core Cortex-R5F processors alongside programmable logic fabric.
• Includes onboard 2 GByte DDR4 SDRAM for high-bandwidth memory access.
• Supports multiple high-speed interfaces including DisplayPort, PCIe, SATA, USB 3.0, and Gigabit Ethernet.
• Designed for rugged operation within an extended industrial temperature range.

Applications

• Industrial automation and control systems requiring real-time processing.
• Medical imaging devices needing high-throughput data handling.
• Telecommunications infrastructure equipment.
• Automotive infotainment and driver assistance systems.

Procurement Notes

Verify current availability status directly with Trenz Electronic or authorized distributors, as supply conditions may vary. Confirm that the specific suffix matches the required hardware revision and component options. Ensure compatibility with baseboards designed for the TE0813 series footprint. Check for any recent Product Change Notifications (PCNs) affecting pinout or electrical characteristics before finalizing procurement plans.

Selection Notes

Select this module when a balance of FPGA flexibility and application processor performance is required in a small form factor. Consider the ZU3EG variant if the design does not require the higher resource count of larger ZU3EG/EG variants. Verify that the baseboard provides adequate thermal management, as the heatsink is often sold separately or included in starter kits. Ensure power supply requirements align with the module's voltage rails.

Part Context

This part belongs to the TE0813 family of SOMs from Trenz Electronic, which are based on Xilinx/AMD Zynq UltraScale+ MPSoCs. These modules are engineered to accelerate development cycles by providing a pre-validated hardware platform. They are commonly paired with baseboards like the TEBF0818 to create complete evaluation or production-ready systems.

Replacement Considerations

No direct public substitutes are confirmed for this exact configuration. Alternative solutions would require evaluating other SOM vendors offering similar Zynq UltraScale+ ZU3EG modules with comparable memory and interface configurations. Ensure mechanical footprint and pinout compatibility if switching to a different manufacturer's module.