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The TE0817-01-4BE21-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC to provide combined processing system and programmable logic capabilities. The module includes integrated DDR4 SDRAM for main memory and non-volatile storage options. It features high-speed interfaces including PCIe, USB 3.0, DisplayPort, and Gigabit Ethernet. The design supports industrial temperature ranges and utilizes rugged board-to-board connectors for reliable integration into carrier boards.
Verify current availability status as this product may be subject to discontinuation or limited supply. Confirm compatibility with existing carrier board designs before procurement. Check for any Product Change Notifications (PCN) that might affect pinout or component sourcing. Ensure engineering support documentation is accessible for implementation. Validate thermal requirements against specific application constraints.
Select this module when both hard processor system performance and flexible FPGA logic are required in a compact footprint. Consider the available I/O count and memory capacity relative to application demands. Evaluate power consumption profiles against thermal management capabilities of the target enclosure. Compare interface availability with system connectivity needs. Assess long-term supply stability for production runs.
This module belongs to the TE0817 series from Trenz Electronic, which focuses on Zynq UltraScale+ MPSoC based solutions. The series provides scalable options for various performance levels within the UltraScale+ family. These modules are designed to accelerate development cycles by providing pre-validated hardware platforms. They serve as core components for custom carrier board designs in professional embedded applications.