TE0817-01-4BE21-A

TE0817-01-4BE21-A

$810.05
  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:Zynq® UltraScale+™

SKU:6a611a05b3aa Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:Zynq® UltraScale+™
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:Board-to-Board (BTB) Socket - 240
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:0°C ~ 85°C

Download product information

TE0817-01-4BE21-A

Overview

The TE0817-01-4BE21-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC to provide combined processing system and programmable logic capabilities. The module includes integrated DDR4 SDRAM for main memory and non-volatile storage options. It features high-speed interfaces including PCIe, USB 3.0, DisplayPort, and Gigabit Ethernet. The design supports industrial temperature ranges and utilizes rugged board-to-board connectors for reliable integration into carrier boards.

Feature Summary

  • Integrates AMD Zynq UltraScale+ MPSoC with dual-core ARM Cortex-A53 processors and FPGA fabric
  • Includes onboard power delivery subsystem with multiple DC/DC converters and LDO regulators
  • Supports high-speed serial transceivers and multiple peripheral interfaces such as PCIe and SATA
  • Features compact form factor with rugged stacking connectors for secure carrier board attachment

Applications

  • Industrial automation and control systems requiring real-time processing
  • Medical imaging devices needing high-bandwidth data transfer
  • Telecommunications infrastructure equipment
  • Automotive infotainment and driver assistance systems

Procurement Notes

Verify current availability status as this product may be subject to discontinuation or limited supply. Confirm compatibility with existing carrier board designs before procurement. Check for any Product Change Notifications (PCN) that might affect pinout or component sourcing. Ensure engineering support documentation is accessible for implementation. Validate thermal requirements against specific application constraints.

Selection Notes

Select this module when both hard processor system performance and flexible FPGA logic are required in a compact footprint. Consider the available I/O count and memory capacity relative to application demands. Evaluate power consumption profiles against thermal management capabilities of the target enclosure. Compare interface availability with system connectivity needs. Assess long-term supply stability for production runs.

Part Context

This module belongs to the TE0817 series from Trenz Electronic, which focuses on Zynq UltraScale+ MPSoC based solutions. The series provides scalable options for various performance levels within the UltraScale+ family. These modules are designed to accelerate development cycles by providing pre-validated hardware platforms. They serve as core components for custom carrier board designs in professional embedded applications.

TE0817-01-4BE21-ATE0817-01-4BE21-A
$810.05
Buy Now