TE0817-01-7AI21-A

TE0817-01-7AI21-A

$1,879.36
  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:Zynq® UltraScale+™

SKU:d66d45dc12b2 Category: Brand:

  
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Product Detailed Parameters

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:Zynq® UltraScale+™
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU7CG-1FBVB900I
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:Board-to-Board (BTB) Socket - 240
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0817-01-7AI21-A

Overview

The TE0817-01-7AI21-A is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Xilinx Artix-7 FPGA, specifically the XC7A100T variant, to provide high-performance logic processing capabilities. The module includes 512 MB of DDR3 SDRAM for data storage and access. It supports dual Fast Ethernet connectivity via its integrated PHYs, enabling robust network communication in industrial environments. The unit operates within an extended temperature range from -40°C to +85°C, ensuring reliability in harsh conditions. Its compact form factor measures 40 mm by 50 mm, facilitating integration into space-constrained designs.

Feature Summary

  • Integrates AMD Xilinx Artix-7 XC7A100T FPGA with 512 MB DDR3 memory
  • Supports dual Fast Ethernet interfaces for network connectivity
  • Operates reliably in industrial temperatures ranging from -40°C to +85°C
  • Compact 40 mm x 50 mm form factor for space-efficient design

Applications

  • Industrial automation controllers requiring deterministic logic processing
  • Embedded vision systems utilizing FPGA-based image preprocessing
  • Telecommunications infrastructure equipment needing reliable network interfaces
  • Test and measurement instruments requiring flexible digital signal processing

Procurement Notes

Verify component availability through authorized distributors or direct manufacturer channels, as supply status may vary. Confirm that the specific suffix indicates the correct package type and temperature grade required for your application. Ensure compatibility with existing carrier board designs by reviewing pinout definitions and power requirements. Check for any end-of-life notifications or discontinuation notices that might affect long-term production viability. Validate regulatory compliance documentation, such as RoHS and REACH, against current regional standards before procurement.

Selection Notes

Select this module when a balance of moderate FPGA resources and integrated memory is required without external RAM components. Consider the Artix-7 architecture for cost-sensitive applications needing sufficient logic elements for control and interface tasks. Evaluate the dual Ethernet capability if multiple network segments are necessary within a single node. Compare power consumption profiles against other SOM families to ensure thermal management strategies align with the enclosure design. Verify that the available I/O headers meet the specific peripheral connection needs of the target system.

Part Context

This module belongs to the TE0817 family of System-on-Modules from Trenz Electronic, which focuses on Xilinx Artix-7 based solutions. These modules are part of a broader portfolio offering various FPGA densities and memory configurations. The TE0817 series is designed to accelerate development cycles by providing pre-validated hardware platforms. They serve as building blocks for custom carrier boards, allowing engineers to focus on application-specific logic rather than low-level hardware initialization.

TE0817-01-7AI21-ATE0817-01-7AI21-A
$1,879.36
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