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The TE0817-01-7DE21-A is a System-on-Module manufactured by Trenz Electronic. It integrates an AMD/Xilinx Zynq UltraScale+ MPSoC, specifically the XCZU7EG-2FFVC1939E device. The module features 4 GB of DDR4 SDRAM and 512 MB of Flash memory for configuration and operation. It utilizes rugged board-to-board stacking connectors to support high-speed transceiver I/Os between the processing system and programmable logic. The design includes an onboard power delivery subsystem with multiple DC/DC converters and LDO regulators controlled by an ultra-low power MCU.
Verify current availability status as this product may be subject to discontinuation or limited supply. Confirm compatibility with existing carrier boards and ensure that the specific package type (FFVC1939E) matches your mechanical constraints. Review the latest Product Change Notification (PCN) for any updates regarding component substitutions or manufacturing location changes before finalizing procurement plans.
Select this module when requiring a compact form factor with integrated FPGA and processor capabilities. Ensure the target application can utilize the available DDR4 bandwidth and Flash capacity. Verify that the required I/O count fits within the 480 terminals provided by the stacking connectors. Consider the thermal requirements of the MPSoC and the efficiency of the onboard power management unit for your specific environmental conditions.
This module belongs to the TE08xx series of System-on-Modules from Trenz Electronic, which are designed for high-performance embedded applications. The series typically integrates Xilinx Zynq UltraScale+ MPSoCs with varying amounts of memory and I/O options. These modules are part of Trenz Electronic's portfolio of development services and hardware solutions, focusing on industrial and automotive sectors.
Check for official end-of-life notifications from Trenz Electronic. If discontinued, consider alternative modules within the TE08xx series with similar pin counts and memory configurations. Verify that any replacement maintains compatibility with the intended carrier board design and software environment.