TE0817-01-7DI21-A

TE0817-01-7DI21-A

$1,998.31
  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:Zynq® UltraScale+™

SKU:39ec6c34842a Category: Brand:

  
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Product Detailed Parameters

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:Zynq® UltraScale+™
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU7EV-1FBVB900I
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:Board-to-Board (BTB) Socket - 240
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0817-01-7DI21-A

Overview

The TE0817-01-7DI21-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded applications. It integrates an AMD Zynq UltraScale+ MPSoC with dual-core ARM Cortex-A53 and quad-core Cortex-R5 processors alongside programmable logic resources. The module includes 2 GB of DDR4 SDRAM and supports industrial operating temperatures ranging from -40°C to +85°C. Key interfaces include DisplayPort, GMII, PCIe, SATA 3.1, and USB 3.0, housed in a compact 40 mm x 50 mm form factor.

Feature Summary

  • Integrates AMD Zynq UltraScale+ MPSoC with heterogeneous processing system
  • Supports high-speed peripheral connectivity via PCIe and SATA 3.1
  • Includes integrated video output capabilities through DisplayPort interface
  • Designed for industrial environments with extended temperature range support

Applications

  • Industrial automation and control systems requiring real-time processing
  • Medical imaging devices needing high-bandwidth data transfer
  • Automotive infotainment and instrument cluster displays
  • Test and measurement equipment with FPGA flexibility

Procurement Notes

Verify current availability status as this specific model may be subject to discontinuation or limited supply conditions. Confirm compatibility with baseboard designs using the official mechanical drawings and pinout specifications. Ensure that the required software development tools support the specific silicon revision installed on the module. Check for any product change notifications regarding component substitutions or firmware updates before integration into production designs.

Selection Notes

Select this module when a combined ARM processor and FPGA solution is required within a small footprint. Consider the 2 GB DDR4 capacity for complex Linux-based applications or large buffer requirements. Evaluate the available I/O headers against the target application's interface needs, specifically DisplayPort and USB 3.0. Verify that the thermal design of the final enclosure can dissipate heat generated by the MPSoC under full load at maximum ambient temperatures.

Part Context

Trenz Electronic specializes in FPGA and SoC modules based on Xilinx and AMD architectures. This module belongs to their UltraSOM+ series, which targets high-performance embedded applications. The company provides engineering support and baseboards to facilitate rapid prototyping and deployment of these modular systems in industrial and automotive sectors.

Replacement Considerations

Consult the manufacturer's official documentation for confirmed substitute parts or next-generation equivalents. Due to the specialized nature of MPSoC modules, direct pin-to-pin replacements are unlikely. Designers should evaluate newer Trenz Electronic SOM variants or alternative vendors offering similar Zynq UltraScale+ configurations with compatible form factors.

TE0817-01-7DI21-ATE0817-01-7DI21-A
$1,998.31
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