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Product Detailed Parameters
- Description：MPSOC MODULE WITH XILINX ZYNQ UL
- Series：-
- Mfr：Trenz Electronic GmbH
- Package：Bulk
- Module/Board Type：-
- Core Processor：-
- Co-Processor：-
- Speed：-
- Flash Size：-
- RAM Size：-
- Connector Type：-
- Size / Dimension：-
- Operating Temperature：-
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Overview
The TE0817-02-4BE81-A is a System-on-Module manufactured by Trenz Electronic GmbH. It integrates an AMD Zynq UltraScale+ MPSoC with dual-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors, alongside programmable logic resources. The module includes integrated DDR4 memory and supports industrial operating temperatures ranging from -40°C to +85°C. Designed for compact embedded applications, it offers high-performance processing capabilities within a standardized form factor suitable for various industrial and commercial deployments.
Feature Summary
- Integrates AMD Zynq UltraScale+ MPSoC architecture
- Supports extended industrial temperature ranges
- Compact modular design for space-constrained systems
Applications
- Industrial automation controllers
- Medical imaging devices
- Automotive infotainment systems
- Telecommunications infrastructure
Procurement Notes
Verify current availability status as this component may be subject to end-of-life notices or limited distribution channels. Confirm specific pinout compatibility with existing carrier boards before procurement. Request latest datasheets and mechanical drawings to ensure integration requirements are met. Check for any product change notifications that might affect long-term supply stability.
Selection Notes
Select this module when high-performance processing is required in a compact footprint. Ensure the target application benefits from the combined FPGA and processor capabilities of the Zynq UltraScale+ architecture. Verify that the available I/O interfaces meet system connectivity needs. Consider thermal management solutions appropriate for the intended operating environment.
Part Context
Trenz Electronic specializes in FPGA and SoM products for demanding environments. This module belongs to their portfolio of embedded computing solutions designed for reliability and performance. The company provides engineering support and turnkey designs to facilitate rapid development cycles for complex electronic systems.
